Electronics Forum | Tue Feb 28 13:46:28 EST 2006 | slthomas
Assuming you're using DOM and shelf life to determine what's good and what's not, you just have to know 1)the rate at which you use it up, 2) how much shelf life is left, and 3) the rate that it goes bad when not refrigerated. From that you can tel
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements
I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about
Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson
| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo
Electronics Forum | Tue Jan 30 18:25:25 EST 2018 | aqueous
This is one of the most common questions I get asked. Why clean no-clean flux. It was stated earlier that no-clean residues are benign. This may or may not be accurate. It depends on several factors including the reflow process. In a perfect world, t
Electronics Forum | Sun Mar 25 08:49:49 EDT 2018 | jacobidiego
Hi experts, Is it normal that a stencil of 0,1mm would produce 45% solder paste volume being printed over the board? Or is a property linked to the solder paste? thanks in advance
Electronics Forum | Wed Dec 08 15:38:43 EST 2004 | Dreamsniper
Hi Guys, Can you help me find couple of Models for the above? Thanks
Electronics Forum | Mon Mar 26 09:32:00 EDT 2018 | cyber_wolf
Usually this is caused by too much solder mask.
Electronics Forum | Fri Nov 23 03:40:09 EST 2001 | ianchan
Hi All, agree 100% on product characteristics SPC, and do find process indicators such as paste Volume, useful to monitor via SPC, the printing process, as printing constitutes "70% cases of SMT defects". We juz purchased a 2nd hand CyberOptics 3D
Electronics Forum | Sat Jun 01 04:27:37 EDT 2019 | gregoryyork
Increase paste volume and use ramp soak spike profiling. Reducing volume of paste often leads to entrapment. Good idea to know difference between voiding and dewetting due to contamination
