Industry News: reflowing and principles (Page 16 of 57)

Advanced Reflow, Selective Solder and Rework from Ersa

Industry News | 2018-01-04 18:42:36.0

Kurtz Ersa North America will exhibit at the SMTA Rocky Mountain Expo & Tech Forum on Monday, Jan. 25, 2018 at the West Club at Mile High Stadium in Denver, CO. The Ersa team will highlight its advanced reflow, selective solder and rework equipment.

kurtz ersa Corporation

Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems

Industry News | 2009-03-19 16:28:02.0

Rehm Thermal Systems is delivering advanced thermal performance for manufacturers around the world with its Dual Lane Vision X Series convection soldering system. Enabling simultaneous lead-rich and lead-free reflow soldering in a single system, the technology is ideal for manufacturers looking to run parallel processes conveniently and cost-effectively.

Rehm Thermal Systems Korea Limited

BTU to Show PYRAMAX and Profile Guardian at NEPCON China

Industry News | 2018-03-29 20:34:39.0

BTU International will exhibit at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center. The company will showcase the Profile Guardian Redundant Process Monitor and PYRAMAX™ 125N Reflow Oven in Stand 1F25.

BTU International

BTU Expands into Northern CA and NV with Assembly Resource

Industry News | 2022-12-21 11:10:43.0

BTU International, Inc. today announced the appointment of Assembly Resource as its new exclusive distributor for reflow soldering systems in Northern California and Northern Nevada.

BTU International

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

Seika Machinery and Malcomtech Announce Recent Merger and San Francisco Office

Industry News | 2015-04-06 20:19:03.0

Seika Machinery announces that effective April 1, 2015, Malcomtech International is a part of Seika Machinery, Inc. (SMI), based in Torrance, CA.

Seika Machinery, Inc.

The Design Principles of Stencil Apertures

Industry News | 2018-10-18 10:24:05.0

The Design Principles of Stencil Apertures

Flason Electronic Co.,limited

KIC in Hall A2, Stand 316 at productronica: Solutions for Reflow and Wave Soldering Optimization, Inspection, and Traceability

Industry News | 2021-10-11 16:06:46.0

KIC will exhibit in Hall A2, Stand 316 at productronica, scheduled to take place 16-19 November 2021 at the Messe München in Germany. KIC are thermal process experts who make ovens smarter. Along with Reflow Process Inspection (RPI) and Wave Process Inspection (WPI), the KIC team will discuss NPI setup, process and recipe optimization for reduced defects, improved OEE, oven performance tracking, and their complete ecosystem of solutions for thermal processes.

KIC Thermal

Gen3 and Finetech GmbH & Co.KG to Exhibit at the iPower4 Conference

Industry News | 2022-11-21 15:48:35.0

Gen3 will exhibit at the iPower4 Conference, scheduled to take place Thursday, Nov. 24, 2022 at Jubilee Conference Centre at the University of Nottingham.

Gen3 Systems

Performance and Reliability Demands Lead Inovar to Purchase Vitronics Soltec Reflow Ovens for High Production Lines

Industry News | 2016-03-07 14:31:54.0

Four Vitronics Soltec XPM3 Reflow Soldering Systems were recently purchased and installed at Inovar, Inc., a full-service EMS provider. The reflow ovens currently are in use at Inovar on its three production lines as well as its prototype line.

Vitronics Soltec


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