Electronics Forum | Tue May 30 21:06:57 EDT 2000 | Dave F
Thames: Welcome. Consider Rev C. It's current and has "better" descriptions. Consider a course. I believe IPC is doing a tourof A-610 and J-001 classes. Different problems have different root causes. For instance: * Cold solder: Moving the c
Electronics Forum | Sun Apr 19 12:54:39 EDT 2020 | davef
A-620G doesn't require 100% wetting to the thermal pad. It requires 100% wetting to the land in the end-joint area. The end joint is the portion of the solder connection that is at the top [or bottom] of the connection. Look at 7.1.3 Solder Joint A
Electronics Forum | Wed Oct 06 03:18:01 EDT 2004 | Joseph
Dear all, Recently our customer complaint that some components being came off from the pcba after dropping test.But the curious is, the leads show visible solder fillet covering more than 75% of termination area on pad, which is acceptable as per IP
Electronics Forum | Sat Jan 01 10:14:30 EST 2005 | davef
East coast, solder connection failure analysis labs in the vacinity of New England are: * American Competitiveness Institute, Electronics Manufacturing Productivity Facility, One International Plaza - Suite 150, Philadelphia, PA 19113(610) 362-1200 F
Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef
IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials
Electronics Forum | Wed May 17 12:08:04 EDT 2006 | Mark
Hello, I have recived from customer PCB where he found that big SMD electrolytic capacitor just fell off. I checked this boards (FR4 , Au/Ni coating). I noticed that all solder remained on the termination of capacitors and looks ok but on the boar
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Wed Sep 15 17:31:40 EDT 2004 | GS
Once you verified for correct profile ( consider CTE mismatch) make sure before you remove PBA from fixture, the temperature is almost at room temperature. If by removing PBA from fixture,and the PBA gets a little bent (warped) just in the area where
Electronics Forum | Thu May 18 11:00:51 EDT 2006 | Chunks
Thanks Doctor - as always, you're right. I must've been typing with my mittens on. It's starting to get cold on this part of the planet these days. I wasn't blaming anyone, just trying to take a few questions marks away so "we're" left with the an
