Electronics Forum | Thu Sep 21 05:46:34 EDT 2000 | Wolfgang Busko
Once you know what your print should look like, means you have found the right apertures, stencil thickness, stencil finish and the right printer adjustments and alignments, the main things to watch for or better to control when printing is in progre
Electronics Forum | Wed Sep 13 12:08:02 EDT 2000 | Dave F
Charlie: I'm with Wolfgang ... The prime cause of your cracked solder joint on a surface mount part is mechanical stress. That�s about as specific as you�re gonna get. More information would be helpful. For instance: * Talk about the distribution
Electronics Forum | Mon Aug 21 20:25:19 EDT 2000 | Dave F
Doug: I guess every solderability preservative has it�s fans. You know what the issue is? � A supplier that makes it�s customer happy by doing a good job processing material!!!! I�m a HASL guy myself � too much heartache with the other stuff. Giv
Electronics Forum | Wed Jul 05 20:54:17 EDT 2000 | Dave F
Hi Patrick: Mike is correct. Taking it a little differently ... The approach you take is dependent on: 1 Type of gold finish 2 Source of the staining. Since you�re talking gold fingers, this is probably hard gold. So, � * If it�s a water or an o
Electronics Forum | Wed Jun 28 12:37:05 EDT 2000 | Brian W.
HASL plating, by its very nature, is inconsistent in terms of thickness and consistency. The plating varies from spot to spot on the pad, as well as pad to pad. This will wreak havoc on your screen printing process and your placement. From talking
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Tue May 30 09:52:21 EDT 2000 | Sal
Problems with dry joints on a 184 pin Berg connector with locating pins.Using a 0.005"screen, on a n-tek finished board and using Nitrogen. The problem is really intermittent.We tryed using a variety of placement forces using our siemens F5. The comp
Electronics Forum | Thu Apr 20 05:35:25 EDT 2000 | Keith Stone
Hi Pete We have a Black and Decker Power File and have mounted it on a bench in an enclosure to capture the hazardous dust. We used a hopper (usually used for guttering!) with a wire mesh over the top (static reasons) mounted in the bench top inside
Electronics Forum | Wed Mar 29 04:14:49 EST 2000 | Marc
Charlie B: You mentioned that you have an air conditioned environment and a RH 0rf 50, baking the boards is predominately done when the history of the PCB delivery and / or previous storage conditions are un known. When I was with a CM, we did this a
Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ
Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these
