Electronics Forum | Mon Oct 28 07:07:39 EST 2002 | cyber_wolf
It has been my experience that when all conditions are as they are supposed to be there should be zero or very little deflection. When you start placing components with pick and place equipment that does not have a Z pressure sense, you run the possi
Electronics Forum | Mon Oct 28 18:59:25 EST 2002 | tkenny007
Specs for Bow and Twist for PCBs (IPC-A-610C, 10.6. There may be an update by now). I also have a note in our quality guide referencing (IPC-TM-650, 2.4.22) and (MIL-STD-105D). In summary, a PCB should not bow more than 0.040" with all four corner
Electronics Forum | Tue Oct 29 15:07:38 EST 2002 | gregp
SOP small outline package, SOIC small outline integrated circuit, VSOP very small outline package, TSOP thin small outline package,TSSOP thin shrink small outline package, QSOP ???, LQFP low profile quad flat pack, VQFP ??? The packages come and go
Electronics Forum | Wed Oct 30 10:26:42 EST 2002 | Randy V.
I would perform a simple solderability test per ANSI/J-STD-002. You can do this using a compatable no-clean flux like Indium NC771 and a solder pot. If the leads wet well you do not have a solderability problem. I did not notice what plating was on t
Electronics Forum | Thu Nov 28 20:37:40 EST 2002 | Dreamsniper
I'm in the process of generating work instructions for our stores and production process with regards to moisture sensitive devices.And I'm a bit confused. I found out that we have many TSOP's, QFP's and BGA parts in sealed bags that have not been op
Electronics Forum | Mon Feb 03 18:20:57 EST 2003 | Stephen
You mean something like stainless steel balls? I'm racking my brain I seem to remember once doing a job for a customer that involved standing clips being SMT mounted, that a heat sheild clipped onto. Another customer used a "fence" around a bunch of
Electronics Forum | Tue Mar 04 18:38:12 EST 2003 | ruggi
Most of what we do (across 800+ varieties) is bottom side first. In general, there really aren't any problems as long as our Customers follow the .25g/cm wetted lead perimeter spec for weight (which many don't), and don't mount tall components on th
Electronics Forum | Thu Mar 06 11:50:22 EST 2003 | John O'Donnell
Greetings Sir, Although I am not qualified to address the issue in detail, I do know first hand that you can obtain very comprehensive and accurate solutions and explanations from George Westby, Director, Universal Instruments Advanced Technology and
Electronics Forum | Mon Apr 07 14:03:27 EDT 2003 | ksfacinelli
We have a client we would like to have switch from leaded can components to surface mount versions. We currently are utilizing these on a number of designs but his concern is in the area of reliability of the solder interface. The caps generally ha
Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve
Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P
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