Electronics Forum: 10 (Page 1536 of 1925)

Re: feeder extension

Electronics Forum | Wed Mar 29 17:10:25 EST 2000 | Jon Wentz

Hi Dave, What feeder model do you have? I took a quick look in my parts list manual and again, depending on your feeder model, you might be able to buy the needed part(s) from Zevatech/Juki. Have you checked with them yet? For example, the main feed

Re: Paste Tack Time

Electronics Forum | Fri Mar 24 10:26:45 EST 2000 | Russ

Sal, Interesting problem, I have found that W.S. pastes tend to have a shorter tack time in real life than what is advertised. Usually the manufacturers specify tack time as after placement let the board sit and then turn it upside down and see if

Re: Tools / Methods to remove solder balls

Electronics Forum | Thu Mar 16 10:41:34 EST 2000 | Russ

Are we talking midship SMT or wave soldering? SMT - I have found the best method is not having them (WOW) this can be accomplished through pad design, aperture design, placement accuracy, and profiling, It is my understanding however, that these

Welcome To CBAR and the Georgia Institute of Technology

Electronics Forum | Fri Mar 10 12:28:24 EST 2000 | Keith Luke

SMTnet extends a warm welcome to the Center for Board Assembly Research (CBAR)at the Georgia Institute of Technology who have joined with SMTnet to provide access to the Electronics Forum through the school's web site. SMTnet is pleased to cooperate

HAL vs. Silver Coated

Electronics Forum | Fri Mar 10 08:42:40 EST 2000 | John

We're quoting out a new board design, and one of the prospective suppliers is pitching a silver coating process over hot air leveling. We haven't had experience with boards of this type, and I am concerned about any processing issues that may come u

RE: Failure of Moisture Barrier Bags Shipped by Air

Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech

This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we

Re: Hot Air Knife

Electronics Forum | Mon Mar 13 14:41:22 EST 2000 | Boca

By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it

Re: Hot Air Knife

Electronics Forum | Mon Mar 13 14:45:01 EST 2000 | Boca

By Hot Air Knife I assume (leave it alone Dave F.) that you mean a debridging knife located at the exit end of a wave solder machine. Russ is right, they are not a good substitute for a good process, but once the process (w/o HAK) is developed, it

Re: footprint formula

Electronics Forum | Fri Mar 03 10:07:15 EST 2000 | Wolfgang Busko

Hi Jacqueline, - what a name in this technical world - I just tried the calculator and for example choose the CQFP and then selected other and an input mask appeared where you have to fill in the required data from the components datasheet. I have to

Re: footprint formula

Electronics Forum | Wed Mar 08 10:52:27 EST 2000 | Wolfgang Busko

Hi Jacqueline, for the "manufacturing allowance" IPC says FAB.TOL. is the board manufacturing tolerance and PLACE ACRCY is the pick and place accuracy. For 0,8 mm pitch they give for both values 0,1 mm. Solder joint design goal data comes from empir


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