Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL
SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed
Electronics Forum | Fri Mar 02 09:08:10 EST 2001 | markkrmp
Frank, I am not talking about the masking on the PCB. I am actually talking about the masking on the solder side of the BGA. We have a very very high dollar BGA and are trying to reclaim alot for reuse. When we remove the BGA from the assembly, you
Electronics Forum | Tue Feb 27 07:51:59 EST 2001 | jackofalltrades
We use Selective Wave Pallets for the vast majority of our boards with great success. Many of our boards have BGA's and connectors on both sides, which for the most part then require the Selective Wave Pallet. We successfully use pallets up to 10mm t
Electronics Forum | Mon Mar 12 10:13:43 EST 2001 | CAL
At APEX I was able to witness the BEAM WORKS Selective Laser Soldering machine operate.Truly impressive. When they told me they could solder a BGA component, I old them they were HIGH as a kite. The board they demonstrated had 4 BGA's on it. When the
Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair
1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl
Electronics Forum | Sun Mar 18 20:48:23 EST 2001 | Doug Leaser
I�m doing some research in the field of routing, or cutting, PCB�s using a non-conventional method as compared to conventional routing machines. I need some accurate feedrates for routing certain PCB materials, as listed below, to compare data. Unf
Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC
Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is
Electronics Forum | Wed Mar 21 20:40:28 EST 2001 | dblsixes
We are building a monster ... Dimensions are 10" x 7" ... 12 layers ... A Logic Assembly with a Power Supply all rolled into one ... The Power Supply is in one section of the board, the logic in the other section ... The Power Supply obviously has a
Electronics Forum | Thu Mar 22 21:10:42 EST 2001 | dblsixes
Ah ha! ... You hit upon something that I discovered earlier today ... As I said in an earlier post, I was going to experiment with dog-boning the solder paste ... But upon further review, I discovered that our customer removed 75% of the pad behind t
Electronics Forum | Tue Mar 27 09:06:10 EST 2001 | dblsixes
We have tried to adjust the upper and lower heaters. We have a dillema in this area however. The power supply portion of the assembly has thermal vias in the solder pads underneath larger pads. We have a problem with solder wicking through these h
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