Electronics Forum | Mon Apr 07 14:03:27 EDT 2003 | ksfacinelli
We have a client we would like to have switch from leaded can components to surface mount versions. We currently are utilizing these on a number of designs but his concern is in the area of reliability of the solder interface. The caps generally ha
Electronics Forum | Thu Apr 10 19:21:02 EDT 2003 | tony_sauve
Kevin, One point that I'd like to make is that in order to get an accurate reading of the solder joint temp's you need to have the thermocouple right at the ball/PCB interface. I'd recommend precision drilling a mechanical sample of the unpopulated P
Electronics Forum | Thu Apr 10 03:29:16 EDT 2003 | emeto
Hi, that post sounds very bad.But I thing you shoul make an order for that problem.First the problem as I can see is not single.If I am right you should do exams step by step: 1.Design of the board-examine very carefuly(ask the manifacturer for help)
Electronics Forum | Thu Apr 17 16:43:09 EDT 2003 | davef
Background: * Bulwith, Ronald A., �Failure Analysis of Solder Joints�, �Insulation/Circuits� magazine, February 1978 * Banks, Donald R., et al., �The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability�, Proceedings of the Technica
Electronics Forum | Mon Apr 28 11:52:28 EDT 2003 | hruiz
Thanks for your responses, as gregp says, one hour in changeover is not good when you run only 10 panels, we alredy do from 10 panels to 2500 boards per run, depends on the product, we already have a pre-kitted area mounted in their respective feeder
Electronics Forum | Thu Jun 26 03:27:35 EDT 2003 | loz
We currently have a requirement to build flexi circuits and mount two 40 way, 20 thou connectors at each end. The flexi pcb's arrived in singlulated format. Ideally we would like to have the circuits panelised for machine building as hand placing the
Electronics Forum | Wed Jul 09 04:57:11 EDT 2003 | Matt Kehoe
Our company applies solid solder to surface mount lands. While processing a micro BGA design we had some pads fall off, peel, whatever you might call it, from the surface of the board when touched "GENTLY" with the tip of a blade to remove a small s
Electronics Forum | Wed Aug 20 18:07:13 EDT 2003 | davef
If you desire fairly uniform paste deposits, consider dispensing your solder paste. Neither a screen, nor a stencil will conform to the rough surface commonly seen in cast aluminum blocks, as you mention. Just out of curiosity: * What flux type and
Electronics Forum | Wed Sep 03 11:09:23 EDT 2003 | severs
This one certainly came to my mind... No doubt this one will go on record as the single biggest technology change in our industry in a decade or more. In fact, have you read this article where Celestica repsonds to this as being a greater challenge t
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
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