Electronics Forum | Tue Nov 27 08:13:04 EST 2007 | davef
C1: is there any gap between the pad and terminal if we place the glue? R1: Yes, there is a gap, but it is easily bridged by the amount of solder in the wave. C2: Btw, my practice to print solder pate then punch glue then PNP component and finally
Electronics Forum | Thu Dec 06 08:57:32 EST 2007 | davef
With this small amount of background information on the situation, comments are: * If you let adhesive cure on your stencil, you should not be using Zestron 301. A hammer and chisel is more effective. * Assuming you are not letting the adhesive cure,
Electronics Forum | Fri Jan 04 09:01:35 EST 2008 | davef
Here's a link to the article that Loco references in the above post: http://www.smtnet.com/library/files/upload/DevelopingaReliable.pdf The table seems to be taking a simplistic approach. J-STD-020C, Table 4-2 lists nine catagories of MSL classific
Electronics Forum | Tue Jan 08 10:10:29 EST 2008 | noid
We are building class 3 products, using no clean on wave and selective solder machines. Both processes are producing micro solder balls between the leads of through hole components. I have searched the site and haven't found any recent threads on h
Electronics Forum | Tue Jan 15 15:42:15 EST 2008 | ck_the_flip
Patrick, you're right. I've only dealt with 2 different flavors of Alpha alcohol-based flux. I've always thought that the convection causes the activator to evaporate more rapidly, but this is probably just the case with older formulations. Again,
Electronics Forum | Fri Jan 18 09:44:15 EST 2008 | operator
I have searched through the topics here and none seem to address this specifically. I was wondering if anyone had any links/info directly showing how proper ventilation for fume extraction on a manufacturing floor should be handled. From my research
Electronics Forum | Fri May 02 16:20:35 EDT 2008 | rwyman
We've never, to my knowledge, sent out Pb-free BGAs to be reballed for use on an SnPb assembly. In fact, we developed an in-house reballing process and we haven't felt the need to do that either (for salvaging an occasional reworked part, maybe).
Electronics Forum | Tue May 13 09:58:50 EDT 2008 | rgduval
Thanks, Dave, To the 183 TAL...I was just referencing a previous post I found in the archives. We checked the profile on the board this morning, absed on the temp info that AIM recommended, and found that we're above liquidous for nearly 2 minutes!
Electronics Forum | Sun Jul 13 16:51:08 EDT 2008 | edmentzer
We are a small contract manufacture who started out using the component manufactures part numbers. That lasted about one month then we had an apple and orange with the same part number. I looked at what my customers were using, one had a real good
Electronics Forum | Mon Aug 18 11:20:08 EDT 2008 | pjc
Stencil apertures are cut to deposit solderpaste onto the annular ring, provided its wide enough. Then you can place a solder preform if needed to ensure there is enough solder to fill the barrel. Here is some information on solder preforms: http://
