Electronics Forum: used (Page 1547 of 2497)

Re: Hot Air Nife

Electronics Forum | Thu Apr 29 17:18:29 EDT 1999 | JohnW

| | | Anyone using hot air nife for wave soldering process. | | | Does it work? | | | Does it really eliminate solder bridging and does it create any other problems? | | | | | | any feed back will be much appriciated. | | | | | | Thanks | | | |

Re: White Tin

Electronics Forum | Wed Apr 28 09:37:54 EDT 1999 | Justin Medernach

| We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | We are considering trying boards with White Tin solderable surface

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 14:59:14 EDT 1999 | Chrys Shea

| Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these g

Re: WAVE SOLDERING and Gluing 0603 packages

Electronics Forum | Fri Apr 23 15:04:44 EDT 1999 | M.T.

| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t

Re: Oven Reflow vs Wave Solder

Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F

| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should

Re: Polyimide stencils

Electronics Forum | Wed Apr 21 12:01:22 EDT 1999 | jseagle

| To all who will be potentially my salvation, | | I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to d

Re: Polyimide stencils

Electronics Forum | Thu Apr 22 17:39:26 EDT 1999 | Earl Moon

| To all who will be potentially my salvation, | | I am currently researching Polyimide stencils for possible use and manufacture. If I may be indulged - with due reference to all past enquiries and notes on the subject - can anyone offer an up to d

You have a point but your tone is questionable

Electronics Forum | Fri Apr 16 11:35:17 EDT 1999 | Cunli Jia @ SMTnet

Dear Brian, You made two points we want to address. The first is that you are concerned about the amount of information we ask in the registration and how it is going to be used. This is a legitimate concern that we need to address, and have tried

Re: Adhesion loss on passives over wave

Electronics Forum | Thu Mar 18 13:54:30 EST 1999 | John

| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet

Re: Shorts on BGA

Electronics Forum | Mon Mar 15 16:07:32 EST 1999 | Earl Moon

| | After rmoving a BGA (plastic)to correct unexplained shorts | | I installed another BGA using flux only. | | Checking on an X Ray machine and found two shorts. | | | | can anyone give a good explenation ? | | | | Thanks | | | | Ron | | | Ron,


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