Electronics Forum | Tue Aug 14 16:25:49 EDT 2001 | Hussman
I thought Dan saw the delamination after wash - not baking? What temp are your dryers on the washer set at?
Electronics Forum | Tue Aug 14 20:47:29 EDT 2001 | Pete
Hi, would like to get good info on the above solder paste metal content regarding their advantage and disadvantage against each other and their effect on fine pitch solderability. regards,
Electronics Forum | Tue Aug 14 21:48:54 EDT 2001 | davef
Say isn't creep a more key issue, rather than strength?
Electronics Forum | Tue Aug 14 22:21:55 EDT 2001 | davef
But isn't elongation more of a quantification of ductility than of creep?
Electronics Forum | Thu Aug 16 05:29:29 EDT 2001 | mugen
Say din't someone previously claim, "Dave F" stands for : Damm.Averted.Verified.Eggbrain.Freakin *smart* ?!?
Electronics Forum | Thu Aug 16 19:58:49 EDT 2001 | davef
Just feel relieved that we didn't go to the matt on the use of "leaching" rather than "dissolution". And you thought this was easy, eh?
Electronics Forum | Wed Aug 15 01:46:43 EDT 2001 | Pavel
Hi, could any body tell me the reason for solder beads apperance and how to aliminate them (solder beads are solder balls that are found along chip body). Thanks,
Electronics Forum | Wed Aug 15 08:16:29 EDT 2001 | wbu
Hi Pavel, what you see is most probably caused by to much solder. There�re plenty of hints to avoid this in the archives, just use the "search" function and look for "solder beads" and "solder balls". That will bring you on the right track. Good lu
Electronics Forum | Wed Aug 22 17:29:29 EDT 2001 | Michael
We've found beading is not neccesarily the amount of paste but where it's applied. Trapping paste under components seems to be the culprit. On components where we couldn't reduce aperature size we simply moved it outward actually overprinting the p
Electronics Forum | Wed Aug 15 12:59:26 EDT 2001 | upinder
Hi All. I am looking for a typical Pull Test Results for the adherence of 0402 / 0603 components to the pads. Thanks USingh
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