Electronics Forum | Wed Dec 07 16:01:45 EST 2005 | JP
I am attempting to reball some PBGA's with no luck. The problem is getting the solder spheres to sit in the stencil apertures and removing excess spheres. I apply light amount of flux to pads of a BGA, align a stencil over a BGA, then pour solder s
Electronics Forum | Mon Jul 13 07:25:09 EDT 2009 | hcarrasco
Hi everybody, > We recently start to use an ultrasonic stencil cleaners for our stencils. > It' work well, but after some time, we saw a lot of fiducial that the black > epoxy have been partially or totaly remove. I want to know if someone h
Electronics Forum | Tue Jun 13 16:53:35 EDT 2017 | sean87
For many moons, I have used IPA for our cleaning > tanks within out DEK systems. Now we have a new > engineering team and he would like to try a > stencil cleaning solution (DEK PRO XF). Can > everyone tell me there pros and cons of using > each
Electronics Forum | Mon Jan 28 16:48:14 EST 2002 | djarvis
Printing with adhesives is no big deal so don't let the sales types try to mystify the process and convince you that they have the only stencils/adhesives/knowledge that can possibly get you through this "trying time" - at a price. Start with 0.010"
Electronics Forum | Thu Jun 28 09:07:51 EDT 2007 | mika
Laser cut 0.13mm stencil thicknes works great for us. BTW, are we talking RoHS solder paste? We do reduce the stencil apertures to 88 % of the pads when we go for the RoHS solder paste. Otherwise we go fo 96% reduction in general with some excemption
Electronics Forum | Wed Feb 16 09:19:22 EST 2000 | MARK ALDER
Please check Circuit Assembly March 1998, article "Solder balls and aperture shapes" and August 1999 "Guiding stencil design". They can be contacted at www.circuitassembly.com The main cause of mid chip solder balls is the volume of paste that is p
Electronics Forum | Wed Dec 13 16:47:41 EST 2000 | Michael Parker
It is apparent that you have evaporated the flux before you reflowed. You got lucky when the paste slumped and you didn't get major problems elsewhere. A more reliable solution is to adjust the stencil apertures for the part that is experiencing bri
Electronics Forum | Thu Nov 02 09:45:00 EST 2000 | bierleinb
I would check trace-pad interactions as you may be robbing heat from one of the pads causing uneven heating during reflow. Also, measure paste deposits on trouble parts to see volume depsoted across the pads. You should easily be able to do 0402s w
Electronics Forum | Mon Aug 28 15:09:22 EDT 2000 | Francois Racine
Hi everybody !!! I`m from Quebec city ( Canada ) and last time I asked a question in this site, I had a lot of excellent answers and also a lot of technical informations from all around the world. Thanks a lot Here is my new question : I`m loock
Electronics Forum | Fri Aug 25 07:37:00 EDT 2000 | Jason
George, We print adhesive on a regular basis. We use LOCTITE 7360 SMT adhesive cleaner. We also purchased a handheld ultrasonic stencil cleaner that works very well. It is very important to keep the glue from curing in the apetures as this will mo
