Electronics Forum: following (Page 157 of 253)

lead free joint finish

Electronics Forum | Fri Jan 30 06:28:42 EST 2009 | gregoryyork

Hi Armando Hotflow 7 is a big machine and one of the best Reflow ovens around (in my opinion), well suited for Lead Free. A typical 1.6mm board has the following settings for Lead Free SAC305 paste All Temperature settings are Top and Bottom Prehea

Calculating Mydata angels with CircuitCam

Electronics Forum | Fri Mar 06 12:23:39 EST 2009 | stepheniii

Are you working for an OEM? If so see if you can get your engineering department to change their "zero orientation" for the packages. At one place I believe the CAD department called them "G codes". What was really bad there was that one shape had

BGA Rework - Pads being lifted

Electronics Forum | Mon Apr 06 11:53:50 EDT 2009 | ed_faranda

Here are some pictures of the part. I created a profile for this part. I've been in touch with the vendor and he seems to think the profile is too hot. I am waiting for another board from R&D so I can work on it again. If you look at the picture,

Quad IVc power up

Electronics Forum | Mon Apr 13 14:36:18 EDT 2009 | leemeyer

I have seen this problem before. There is a cable that runs from the Quadalign board to the backside of the backplane. It is not secured in any way so it may have come loose in shipping. Open the right side panel on the machine. The Quadalign board

0402 tombstones

Electronics Forum | Fri Apr 17 10:44:29 EDT 2009 | rmitchell

Hi, follow up, Thanks to everyone that responded. We finished the build, the sun burst thru the clouds and the birds sang. Well that was a slight exageration. Sorry for lack of detail on the original post, I was frazzled. Since the 0201's were p

underfilling of bga

Electronics Forum | Fri May 22 15:37:23 EDT 2009 | 1smtdude

Depending on the material chosen, it's possible to �rework� underfilled components. However, it's far from a production process. Two steps are usually required. First: remove the package from the PCB. Second: remove the residual underfill from the P

American RoHS

Electronics Forum | Fri May 22 10:32:51 EDT 2009 | patrickbruneel

By law any forthcoming legislation in this area needs to be in compliance with http://www.nepa.gov/nepa/regs/nepa/nepaeqia.htm This requires an Environmental Impact Report (EIR) be prepared. Such a report has been done by the EPA in 2005 �Solders i

Vision Type for Dpak in SMD3-Fuji Flexa (IP3)

Electronics Forum | Wed May 27 18:19:58 EDT 2009 | dcell_1t

yesterday I tried with vision type 20, just defined the two pair of leads and error 1CA14003 came up, on flexa error help says the following: Cause: The Vision_type in part data is expressed using hexadecimal notation (??). If ?? equals 0A, 0B, 0C,

Crazing or Delam - Thermal or Mechanical?

Electronics Forum | Fri Jun 19 07:28:56 EDT 2009 | mhunter

Thank you for your responses Davef and Boardhouse. The material used is Iteq Corporation IT-180. I performed more testing yesterday and found the following: I could insert Berg Pins into the assembly at various locations or a Pem. None of these

AOI Sony vs Orbitech

Electronics Forum | Fri Aug 14 10:51:30 EDT 2009 | rway

If he is the same Martin Gershenson who works for Christopher, then I'de believe he's being sneaky. We demoed one of their units three years ago, along with Mirtech and YesTech. Of the three, they were the only ones who wouldn't let us experiment w


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