Electronics Forum | Thu Nov 13 17:47:00 EST 2014 | warwolf
could always use a potato? http://www.smtnet.com/Forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9994&#Message56920 But seriously.. best idea is to stay away from any metal as the tin will likely dissolve and contaminate your solder pot.
Electronics Forum | Mon Jan 09 23:24:47 EST 2017 | saju86ece
Hi, We are doing pin in paste reflow process in one our product ( but paste printed on bottom side of the board and top side will be assembled through hole component)in which faced cold solder issue in THT capacitor location after reflow. The solder
Electronics Forum | Wed Jul 15 03:20:51 EDT 2020 | wellmanrau
Dear Sir: We have the coating machine with good performance and price for market promotion. We have been producing the SMT machines and intelligent equipment for many years, integrated Design, R&D, Production, Sales and Technical Service. What produc
Electronics Forum | Fri May 26 04:58:19 EDT 2023 | auriga2001
I agree with the two other replies. Left alone, it is a defect. If it's just excess adhesive or coating, you can use IPC-7711/7721 'Rework, Modification and Repair of Electronic Assemblies' for guidance on removing. Section 2.3.1 explains how to te
Electronics Forum | Wed May 05 03:57:00 EDT 1999 | Bernard Mulcahy
| Hi Ya' John! | | Here's my comeback to the points you've raised...you knew I would have a comeback, didn't ya'? | | |Steve, | | | | I see your point, and yes there are alot bigger fish to fry in |the removal or control of lead in the environment
Electronics Forum | Fri Dec 04 13:25:34 EST 1998 | Jeff Sanchez
| | | | Does anyone have any information or experience with the use of conductive epoxy in leu of solder. I have a unique application that might lend itself to this technology. I am looking for manufacturers, printing, curing and reliability info. |
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Mon Apr 03 23:17:51 EDT 2000 | Brian G
We have been experiencing intermittent problems with the solder masking bubbling up from the bottom side of the board, after wave soldering. Our board fabricator claims that none of his other customers are experiencing this problem, and that it is pr
Electronics Forum | Tue Apr 10 13:12:41 EDT 2001 | davef
You've told us nothing about your situation, process, boards, or anything!!! If you leave some boards with very fine solder connections on the shelf for a cuppla years, the grain will become coarse. What do you mean when you say "grainy"? What is
Electronics Forum | Sat Jun 30 11:28:24 EDT 2001 | davef
Consider using a roll solder with a flux that well matches the residues you can accept to be remaining on the board when you get finished processing. Many people use a no-clean flux cored roll solder for such operations, because they don't want to c
