Electronics Forum | Thu May 30 07:13:46 EDT 2002 | matherat
Ben, I am not sure about diamond shaped pads but if you are just getting into BGA you need to know about SIPAD ssd. http://www.sipad.com mkehoe
Electronics Forum | Tue Jun 04 05:41:42 EDT 2002 | ianchan
Yo, Hussman69, you are one scary dude... in fact you remind me of that catbert... as an add-on, "metcal" has a good semi-auto BGA rework system and their engineering support is strong. then again, our engineers shd be optimizing the production lin
Electronics Forum | Fri Jun 07 15:16:25 EDT 2002 | gdstanton
Ben, Get a copy of IPC 7525 and review it. This will help you understand the relationship of aperture geometry to paste transfer. Good Luck, Greg
Electronics Forum | Mon Jun 24 17:13:27 EDT 2002 | garyfosburg
We, too, are getting into BGA manufacturing. In order to start experimenting, we're looking for a place to buy test boards with Gerber so that we can experiment prior to "going live" with a customers BGA requirements. Does anyone know of a company th
Electronics Forum | Tue Jun 25 16:15:20 EDT 2002 | dason_c
Hussman, I know when the oven temp at around 140F and the relative humidity is below 10% and meet the J-STD requirement but I never see any recommendation from the supplier to store @ this temperature. Can U advise where I can get more information?
Electronics Forum | Wed May 29 22:22:28 EDT 2002 | davef
I don't think thay offer that specific alloy, but if you check with Kester, Alpha, and Indium; they might be able to suggest a supplier or an alternate product thaat is quite similar.
Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell
Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell
Electronics Forum | Wed May 29 10:14:04 EDT 2002 | Hussman69
You mean the destructive test were you continually push on a part until it breaks free from the board and flies across the room?
Electronics Forum | Wed May 29 21:56:47 EDT 2002 | davef
We have talked about testing the cure of glue, epoxy holding secondary side compomponents in place prior to wave soldering several times here on SMTnet. Search the fine SMTnet Archives, if that's what you're seeking.
Electronics Forum | Thu May 30 11:19:29 EDT 2002 | Hussman69
Ooops, my bad. "Curse your eyes Nell, for even asking a question on this forum. Check the archives before we put a curse on your adhesive process and force you to ask another question!" Whew, hope that made up for my mistake.
