Electronics Forum | Mon Sep 24 20:33:34 EDT 2001 | davef
Assuming you're seeing this during wave solder, the via acts like a heat pipe conducting 450�F [or whatever] air to your solder balls. Check the fine SMTnet Archives for similar threads and perspective on the direction to take.
Electronics Forum | Mon Sep 24 20:49:59 EDT 2001 | jagman
I'm not seeing this during the wave solder process, rather the REFLOW (convection) process. The board was design with the vias located "in" the land area.
Electronics Forum | Wed Sep 26 09:01:38 EDT 2001 | hinerman
I'm afraid I only have data that has been published previously. What I do have was created when working for other companies and can not be shared, sorry. Perhaps someone else may be able to help. Regards Jay
Electronics Forum | Wed Sep 26 11:58:13 EDT 2001 | Fox
Don't hold me to it but... Class 1-process indicator, varify value (cap, resistor) Class2,3-failure (rework required) This is what we used at my former job when i took over QA responsibility.
Electronics Forum | Wed Sep 26 12:31:02 EDT 2001 | nifhail
Let's assume that SMT or MEMS or COB etc, is a new things and about to be introduced to the line, nobody knows about this new process and I was asked to select the critical proceses and parameter, how and where should I start? Thanks and best rega
Electronics Forum | Thu Sep 27 13:11:07 EDT 2001 | Nankar
what factors should be monitored and controlled during assembly of components on PCBs and their storage? Temperature and humidity seem obvious. Should one also watch out for any particular gases that may cause oxidation? Or dust?
Electronics Forum | Sat Sep 29 04:05:09 EDT 2001 | chinaman
Hello Dave, I was looking for the standard J-STD-001 you mentioned, but I coudn't find it. Was it withdrawn?
Electronics Forum | Mon Oct 01 18:52:31 EDT 2001 | Product Guy
I am interested in learning if there are any standards regarding markings (text) that appear on components. In order to properly supply an OCR/V to my company's customers I need to find more information regarding component markings to develop a sati
Electronics Forum | Tue Oct 02 20:47:30 EDT 2001 | davef
There is no standard that describes component part marking requirements. Component fabricators take different approaches to marking. The major marking methods are: * Laser * Epoxy * No marking Maybe with this as a starting point, we can discuss yo
Electronics Forum | Tue Oct 02 07:23:37 EDT 2001 | cath
Has anyone caried out a DPM analysis on these components. I would be interested to know the defect rates and other assoc. placement issues as we have never placed them before. Thanks, cath
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