Electronics Forum | Thu Jun 28 16:43:51 EDT 2012 | ssupertuba
Yes I have a KIC and have checked the profile often. I just changed the reel of the parts that are causing problems and it went away. Now what am I suppose to say? I have made an NCMR for the parts but I'm sure they would work in an environment of
Electronics Forum | Thu Jun 28 09:40:49 EDT 2012 | austinpeterman
We just stepped into the inline wash world with a techical devices new clean galaxy plus. We are noticing a significant amount of foaming when washing our boards after selective solder. One theory is that the water soluble flux used is not being cu
Electronics Forum | Fri Jul 06 10:45:02 EDT 2012 | ashworth14
In relation to question 2 the vacume on them is quite sensitive so as long as you bring it down slowly the component is almost sucked up off the PCB so you don't have to actually press it down on the the component, and i have never experienced any so
Electronics Forum | Mon Jul 23 14:44:22 EDT 2012 | hegemon
If your pick and place can handle the part placements, you are most of the way there. X-Ray for Inspection of BGA and other bottom terminations = $60K(USD) and up. BGA Rework Station $40K and up. You can reball most any BGA with your Rework station.
Electronics Forum | Thu Jul 19 18:25:42 EDT 2012 | boriskilk
We have picked up a new customer who is insisting on Ionic cleanliness less than 6.45u grams/cm2 when measured in accordance with OPC-TM-650 Method 3.26.1 with measurements made immediately prior to solder mask application. This is the first request
Electronics Forum | Fri Aug 10 06:40:20 EDT 2012 | thmeier
The unique heat on the PCB is the big advantage and you also can´t exceed the temperature of the boiling point of your medium (we use a 240°C Galden). So small components are not "overheated" until the bigger ones like DPAKS are soldered. You also ne
Electronics Forum | Thu Aug 16 04:35:10 EDT 2012 | craigweir
Can anyone advise on the risks involved in using a (previously soldered) component, in this case an 'SOIC8', as pick-up area for subsequent pick/place operation of sub-assy to larger motherboard ? The sub-assy in question would be a small outline(25
Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Electronics Forum | Wed Oct 03 09:23:21 EDT 2012 | kkay
Well what we have seen so far is that the voiding occurs on nearly every part, but only underneath the terminations. When we run a board with no parts we do not see any voiding as there are no terminations to trap the out-gassing from the pads. Next
Electronics Forum | Sun Oct 21 22:17:19 EDT 2012 | eadthem
We have had this issue on several parts in the past, typically we use a grid of squares of solder paste on large flow areas, This helps reduce but not eliminate all voiding. I would be very interested in hearing what you come up with. O and what is
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