Electronics Forum: tinning (Page 160 of 169)

Resonator Cracking

Electronics Forum | Fri Nov 16 03:23:15 EST 2007 | jwsmt

I'm requesting assistance in developing detection and containment methods for an issue with an SMD ceramic resonator (Murata CSTCE-G-A family). The returns have external visual cracks that originate at the termination and run at approximately a 45 d

Comformal Coating Stripper

Electronics Forum | Wed Feb 27 13:11:04 EST 2008 | tonyamenson

I was asked to post my finding about HumiSeal stripper for polyurethane coating. Both as an information sharing as well as someone who may offer advice on teh situational use of 1063 solvent stripper. So here is what I found: The stripper worked t

Seica Firefly - Issues?

Electronics Forum | Fri Mar 21 15:51:23 EDT 2008 | g2garyg2

Thought I would reply and try to assist. PROMATION, my company, also manufactures Diode Laser soldering systems but with this stated we also manufacturer iron tip systems, soft beam systems and hot air solutions. The reasons are simple. Diode Laser

Disposal of ultrasonic cleaning water

Electronics Forum | Tue Jun 24 13:46:21 EDT 2008 | bschreiber

I know it is not what you want to hear, but first and foremost, you must consult your local regulating agencies and here is why: Solder paste contains heavy metals. We are all familiar with the problems associated with lead, but lead free solder pas

BGA Placement Process

Electronics Forum | Fri Mar 26 09:00:19 EDT 2010 | krish_bala

Thank you Graham for the response. The particular BGA that we currently Bake is a Level 3 BGA, which means the BGA will expire in 7 days after removal. We are currently baking the BGAs once a week for the problem described above. These devices are u

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: BS

Electronics Forum | Thu Aug 24 15:12:29 EDT 2000 | Earl Moon

I don't entertain the forum like JAXSUN. I never have played games but for some humorous insights. I, when participating, never complained until management provided only more incentive to advertisers than forum members. That said, the following is a

Re: BGA PAd Soldermask

Electronics Forum | Wed Feb 16 21:51:29 EST 2000 | Dave F

Kurt: Lots of choices, not many of them good, yano. 1 So LPI has taken over the market pretty nearly 100%, but it won't "tent" reliably, because it is not very viscous when applied and drops into the hole. So then, tenting/plugging with LPI is bad

Re: Solder surface tension

Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian

| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa


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