Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire
I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub
Electronics Forum | Thu Mar 16 14:04:14 EST 2000 | Cartman
Greetings. My company has a VOC-Free no-clean wave solder flux with 4% solids. I have a number of questions as they relate to our ICT Fixtures. Currently, we're encountering the following issues: 1.) PM on probes....What is the recommended PM p
Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B
I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi
Electronics Forum | Thu Mar 15 15:36:39 EST 2001 | traviss
Don�t be afraid of the more standard doubles sided mixed process. Even without a chip wave it works, don�t get me wrong it works better with the chip wave, but even without chances are you will be spending more on the additional steps than you would
Electronics Forum | Wed Mar 14 17:11:57 EST 2001 | davef
First, x-ray inspection machines have a wide range of capilities. Resolution is a key measure of a machine's ability to "distinguish" features. People say that some x-ray inspection machines have the ability to position the board being inspected at
Electronics Forum | Tue Apr 10 17:44:13 EDT 2001 | davef
Listen, there is a $20 to 30k laseriffic paste measuring system that is not only very expensive and a major bottle neck, but its limited accuracy is the kicker that makes this little item a really special!!! [What a combination, eh???] And that doe
Electronics Forum | Thu Jul 20 16:42:52 EDT 2000 | Bob Willis
Here are the details for the OU Lead-Free Project Introduction The Open University Solder Research Group aims to facilitate the implementation of lead-free solders by evaluating their mechanical properties, especially those which are influential to
Electronics Forum | Mon May 07 09:46:15 EDT 2001 | orbotech
3D imaging refers to the acquisition of images from multiple perspectives using, preferably, multiple sources of illumination, while 2D imaging refers to the acquisition of an image from one perspective. An AOI system with 3D imaging is able to acq
Electronics Forum | Wed May 09 13:11:22 EDT 2001 | zam_bri
Hi.. Recently, I have received a few reels of 0402 with an old date code ( but still less than 2 years old).I don't have a capability in-house to carry out the solderability test except for the dipping test ( dip the components in the molten solder
Electronics Forum | Mon May 14 17:12:20 EDT 2001 | davef
Continuing along the path that Brian took ... IPC-7525 gives design guideline for stepped stencils. It goes something like: * Stepped area SB GT 25 thou from pads located on the greatest thickness of the stencil * Pads in stepped area SB GT 35 tho
