Electronics Forum: 3

DI Filration And Bacteria

Electronics Forum | Fri Apr 24 13:33:25 EDT 1998 | Scott Davies

I inherited a DI system that's um...not in good shape. I would be forever indebted to anyone who could help me with several problems related to this. Flow rate 3.5-5GPM Incoming pressure:50PSI Application: deionized water provided to Electrovert H-4

Baking time for PCBA rework

Electronics Forum | Wed Apr 24 21:35:34 EDT 2002 | davef

Ooooo, much better. Tough to say, because of all the variables [ie, different materials, moisture level, temperature, etc]. Plastic encapsulated devices, especially IC, absorb water from the air, which is violently released during soldering. Typica

Component Lead Finish - Article in Japanese Can some body help ?

Electronics Forum | Wed Nov 20 18:41:57 EST 2002 | slthomas

Here's part of what I could read: "We evaluated the influence of Lift-off (Fillet-lifting) and the influence of thermal fatigue, in this case on combination between various terminal platings of electronic components and Pb-free solder, Sn-37Pb solde

bulk feeding chips

Electronics Forum | Mon Feb 03 16:56:41 EST 2003 | jonfox

We are currently NOT using bulk, even though we looked into as a means of reducing machine time and component cost. Unfortunately, since bulk cassettes did NOT take the industry by storm as it was predicted years ago, we were stuck with long lead ti

Tantalum caps causing misaligned parts

Electronics Forum | Fri Mar 21 09:08:53 EST 2003 | mantis

Hi all, I have a strange problem,while building a large 15x15inch 3.5mm thick Pcb.During topside reflow i am experiencing some misaligned parts and even bridging on a bga that are sitting very close to a D size tantalum cap.The strange thing is that

solder fillet peeling

Electronics Forum | Wed Jul 02 12:42:58 EDT 2003 | slthomas

Not sure how else to describe this. We've received some boards (1/2" x 3.5" x .0325" board built on panels of 24) with numerous resistors showing separation of the solder from the metallization at the top of the joint. There are 26 0805's on the bo

QFP Removal

Electronics Forum | Mon Feb 16 15:47:54 EST 2004 | Jim

I have about 200 PCB's from which a 20mil pitch QFP must be removed, cleaned and re-used (will place them back in trays for the P&P machine to place the parts on new boards). My intitial concern is: how can we remove the parts in an efficient manner?

Terminal solderability + Silver plating

Electronics Forum | Tue Aug 10 06:29:49 EDT 2004 | Nippy

Hello, I am in need of some assistance with a problem we are having with soldering some terminals... Basicaly I need to solder thin tabs onto a round metal post (hole through tab) We have been seeing poor quality joints, de-wetting and what looks l

soldering irons for lead free

Electronics Forum | Tue Jul 12 09:51:42 EDT 2005 | russ

We use the JBC irons with and without the "leadfree" tips. We really have not noticed much difference between the standard and the lead free. The lead free tips do last a little longer but the tips are somewhat deformed by the extra plating. As f

Reflow Oven Selection

Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian

We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so


3,5 searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
PCB Handling with CE

Software for SMT placement & AOI - Free Download.
Voidless Reflow Soldering

Training online, at your facility, or at one of our worldwide training centers"
SMTAI 2024 - SMTA International

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

Low-cost, self-paced, online training on electronics manufacturing fundamentals