Electronics Forum | Sat Jan 22 18:16:05 EST 2011 | eadthem
Hey "vpblf" i was wondering if you had herd much from mirtec about fixes for the repair plus issues?(good image duplicated on bad image, no arrows, missing good or bad images, missing problems, problems from a different board showing up under the wro
Electronics Forum | Mon Jul 08 14:52:40 EDT 2013 | hegemon
The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via. The solder mask may have been damaged or missing prior to mounting the BGA device. The larger balls at the top right are due to uneven heating during
Electronics Forum | Mon Aug 22 10:21:55 EDT 2016 | philc
If you set the "Base Window" (ie - body of the component) to by viewed by the vertical light, it will give good contrast, and ours usually detects the missing metallization from one or other end, but only on the top-side, obviously. If the metallizat
Electronics Forum | Sat Mar 17 22:11:49 EDT 2018 | jacobidiego
Hello experts, I wonder if you have any recommendation regarding reducing the boards needs to be washed out.... it is mainly generated due to first miss-printing after each Production Order setup.... but since board washing is a very manual process,
Electronics Forum | Tue May 19 12:09:08 EDT 2020 | greezmky
Thank you all that contributed to the troubleshooting! I measured the height of 10+ parts with calipers and found the average to be around 2.15mm. In the program height was set to 2.42mm. I reduced the height to 2.15mm. I have since ran 561 boards
Electronics Forum | Thu Mar 02 20:33:31 EST 2023 | oxygensmd
There is a worning parts inside the coupler, if worn the coupler miss the accuracy. Second one is the offset mechnic which also can miss the accuracy. Offset mechanic is under the plate (next the operator door). Check it by hand to be stable and be m
Electronics Forum | Mon Sep 13 21:18:29 EDT 1999 | Dave F
| Hi, | | Recently encountered missing components problem at the SMT process. | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. Checked t
Electronics Forum | Wed Sep 15 20:30:57 EDT 1999 | Bach Huss
| | Hi, | | | | Recently encountered missing components problem at the SMT process. | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post reflow. C
Electronics Forum | Tue Dec 05 13:34:51 EST 2000 | NickMata
Hello all, at the present I have some product onto which I glue backside components. I dispense a pattern of "witness" to use as a visual cue as to the quality of the dispensed glue dots. A problem which I have encountered is that operators will oft
Electronics Forum | Wed Nov 28 01:28:32 EST 2007 | shy
Q1:What is the relation between component standoff and drop missing? A1:component standoff will identify either solder paste at SMT side can form the fillet at component terminal or not. Drop/missing component is totally out of the topics since i jus
