Electronics Forum | Sat Jun 07 00:21:50 EDT 2003 | kevyeoh
J-STD-020 Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices. There's a profile for Lead Free and another for normal Sn/Pb.
Electronics Forum | Fri Sep 07 14:55:25 EDT 2007 | jseagle
Change to through hole or hand solder. we are in the same boat and have not foound a reflow solution. James
Electronics Forum | Thu Jun 19 12:48:32 EDT 2008 | mumtaz
What the hell our you talking about 200 c max? I would think any nolead part is capable of going hi-er that this. I think you are looking at max temps or something that does not make sents for temps you need to reflow.
Electronics Forum | Mon Jul 12 07:47:41 EDT 2010 | rgduval
Talk to your paste manufacturer, they can recommend a reflow profile (as well as advise the paste activation temperature, and liquidous reflow points. The ENIG finish should not affect your reflow parameters any more than the solder paste. Typicall
Electronics Forum | Mon Sep 10 14:42:42 EDT 2007 | cyber_wolf
How big is the cap ? We successfully reflow caps that measure aprrox .750" x 750" at the base and are .678" tall. The ovens we use are Vitronics XPM's.(1230,1040 and 930) We also process these caps through our Omniflow 10. As stated, oven length wi
Electronics Forum | Wed Jun 20 12:07:13 EDT 2001 | Steve
I would suggest getting a copy of IPC-SM-782A, Surface Mount Design and Land Pattern Standard, and IPC-7525 Stencil Design Guidelines. My experience is that reflow does not cause tombstoning very often. Pad and land design, paste volume, and placemen
Electronics Forum | Fri Jun 06 07:23:18 EDT 2003 | johnw
Hi Kevin, the profile doesn't actually qualify something as lead free or not it's purely the Pb content of the assembly that does this. Currently the understanding of the limitations of the lead in the jont is 0.1% by weight or less. So as long as y
Electronics Forum | Mon Jun 18 13:29:34 EDT 2001 | nifhail
What is the recommanded profile for board which consist of 0402 & 0201 comps. to reduce the effect of tomb-stone. Slow ramp rate ? how slow is considered as slow. Soak time 60 or 120 C,at which end should I stick to? what is the best time before reac
Electronics Forum | Fri Apr 04 18:16:43 EDT 2014 | garym4569
We are in the process of launching a new product and found reflow solder issue with one of the inductors. I have set oven profile to paste specifications. I just finished profiling with thermocouple under problem component. All other components ex
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
