Electronics Forum: cleaning process (Page 162 of 202)

Solderball Removal

Electronics Forum | Thu May 23 03:10:43 EDT 2002 | ianchan

Hi mates, need your advise here. we have solderballs on a model due to neglect by stubborn folks to follow issued process control instructions. the post-reflow PCBA has solderballs stuck in the NC flux residue and is not in compliance to IPC-A-610

pc board defects

Electronics Forum | Sun Sep 15 08:35:42 EDT 2002 | davef

That 60+% print defects number has been bantied around for so long in the electronic assembly business for so long that people believe that it's true. One starting point for this myth and lore is: "Where Quality Is Lost On SMT Boards" C Mangin, 'Cir

Help! BGA Socket / BGA Direct Placement

Electronics Forum | Thu Nov 14 11:08:29 EST 2002 | bcceng

Kevin, I have done the following process to a similar problem: 1. Plug holes (even to both sides of the board) 2. Clean any flux left on the surface, especially on bottom side. 3. Apply Kapton tape to the bottom side, you mite want to apply 3 layers

Pencil Use writing onto IC

Electronics Forum | Wed Dec 11 01:06:28 EST 2002 | iman

Was visting a production floor, of an SMT assembly line, and saw operators using mechanical pencils to write "process stage identification markings" onto the SOIC packages, after the post-reflow inspection. was wondering if such pencil markings is c

Inline Washers

Electronics Forum | Thu Feb 27 16:38:01 EST 2003 | russ

James, The last time I evaluated in-line cleaners (2 yrs ago)the Aquastorm was by far the best. They were the easiest to maintain, acheived the highest cleanliness level (per in-house testing with omegameter 600 heated solution), and were the quiete

16 mil pitch QFPs / solder paste type 4 & 5?

Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris

I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog

Copper oxide

Electronics Forum | Thu Jul 31 11:33:51 EDT 2003 | yngwie

I faced problem over connecter's pin that were hot air soldered. This connector has 168 pins ( similar to the straddle connector ). The process is to apply the flux onto the connector's J-leads, and the hot air pencil were then ran thru' the leads to

To overcome human problem

Electronics Forum | Mon Dec 22 08:20:34 EST 2003 | kauerr

Hi,I am a Mfg. Engineering Tech. and do Maintenance on all of our Equipment. 4796 HSPs, Dek 265 LT screen printers, GSMs, ect. We have 6 lines of equipment with certain operators assigned to each line, and you can really tell which operators do or do

QFP Removal

Electronics Forum | Tue Feb 17 10:55:49 EST 2004 | bobbyv40

Hi Dave, 1. As far as speed of removing componants, we use a board preheater to bring board temp to about 150 C. Then add a flux and then flood all 4 sides of the componant with the low temp solder. Using a suction tool the part comes right off. The

Freshman in SMT industry needing advice

Electronics Forum | Thu Mar 04 22:57:32 EST 2004 | Ken

I have an Aqueous Technologies stencil cleaner and I can see many SAWA advantages over the "larger" machines. 1. Floor space savings 2. Chemical cost (up to 30 dollars a gallon) 3. Hand ultra sonic cleaning could never destroy the webbing and bon


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