Electronics Forum | Fri Jul 03 03:49:06 EDT 1998 | chris Link
| | Has anyone experianced Core Dump errors with their MYDATA TP9? | | My machine (2/96) has 26 million placements and my operators | | have recorded 253 core dumps in 1996, 238 in 1997, and 18 in | | January of 1998. We run one job on the machine,
Electronics Forum | Fri Jul 03 03:47:59 EDT 1998 | chris Link
| | Has anyone experianced Core Dump errors with their MYDATA TP9? | | My machine (2/96) has 26 million placements and my operators | | have recorded 253 core dumps in 1996, 238 in 1997, and 18 in | | January of 1998. We run one job on the machine,
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Wed Mar 18 22:43:07 EST 1998 | Scott McKee
| | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | Mike | | Yes and often
Electronics Forum | Thu Mar 26 23:17:04 EST 1998 | Marty Fox
| | | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | | Mike | | | | Yes a
Electronics Forum | Thu Mar 19 11:48:56 EST 1998 | Earl Moon
| | | Is there anyone out there required by their customer to clean the finget tab contacts even after using noclean paste? We have been asked to clean even though we don't have any flux residue on the contacts. Any ideas? | | | Mike | | | | Yes a
Electronics Forum | Wed Aug 08 21:24:52 EDT 2001 | davef
First, not that it�s bad, but SM-782, the land pattern standard is a pretty far distance from a DFM check list. Now, if you�d said D-275 er more properly 222X, ama be twitchin� less. Second, your process should include two distinct elements: 1 Data
Electronics Forum | Wed Apr 10 08:39:11 EDT 2002 | Alan W.
Here are some of the problems (and my pet peeves) that can be found during a machine set-up. I have run into each of these many times over the years. Wrong part value: This can usually be traced to a purchasing, incoming inspection, or kitting mist
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
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