Electronics Forum | Thu Aug 12 20:31:57 EDT 1999 | Kelly Morris
| | Hello | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | 100 durometer blade. Getting "tails" o
Electronics Forum | Thu Aug 12 20:48:05 EDT 1999 | JAX
| | | Hello | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | 100 durometer blade. Getting "
Electronics Forum | Thu Aug 12 21:08:39 EDT 1999 | ScottM
| | | | Hello | | | | | | | | Having a problem with bridging on 20mil pitch qfp, only on the lead groups where squeegee goes over width of apertures. Using MPM sp-200 semi-auto, chem-etch stencil, 9-10mil width opening | | | | 100 durometer blade. G
Electronics Forum | Fri Jan 08 16:48:13 EST 1999 | Earl Moon
| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what ac
Electronics Forum | Tue Dec 22 14:29:08 EST 1998 | Earl Moon
| | I have a mixed technology board ranging from 50 mil pitch devices to 20mil Qfp's to PBGA-352 at 1.27mm, and 6 Intel uBGA-48 at 30 mil pitch. With all these different package types i'm torn between using a 4 or 5mil thick stencil. The ball dia. is
Electronics Forum | Sun Mar 18 23:01:11 EDT 2007 | diesel_1t
Hi there, I want help on the following issue. Where I work, we place a component QFP 256 terminals (20 mil pitch)from hitachi (renesas), we use a MPM UP-3000 screen printer, IP-III placement machine and Vitronics 8 zones reflow Oven. lead plating
Electronics Forum | Wed Mar 12 13:16:42 EDT 2008 | ipdisplays
Hi All, I know some of this has been covered - but nothing recent that I could find - so please bear with me... Seems like the used/refurb market is kind of fluid so would like some current thoughts.... I'm looking to setup an inexpensive prototype
Electronics Forum | Fri Aug 27 13:24:19 EDT 1999 | swsng
| What are the key steps to achieving high yield with CSP ??? | | (We are trying qualify vendors for volume fab/assembly of some | products which use several CSP devices on each side of the | board. (Some with 0.5mm ball pitch)) | | Looking throu
Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
Electronics Forum | Mon Apr 13 17:03:40 EDT 1998 | EFData
We are having some difficulty soldering a 240 pin Altera device. We use Alpha WS-609, a very generic profile for that solder paste, and a 6 mil stencil with laser cut apertures (1:1 ratio). This is a 20 mil pitch device (aperture size is 10 mils X 75
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