Electronics Forum | Wed Jul 09 14:47:39 EDT 2014 | deanm
I'm looking for a typical SMT placement defect rate from others in the field so I can judge whether or not we are in an acceptable range. If I give you a board with 200 components (0603, 0805, SOICs, 20mil MSOPs, tantalums, DPAKs and a few 20mil fin
Electronics Forum | Sat Feb 27 15:14:08 EST 2021 | researchmfg
Does anyone know what defect in SMT will be caused by dust contamination? What dust level in SMT environment is recommended? Recently an audit come to factory and ask we must control the amount of dust. Why SMT line need to control the dust level?
Electronics Forum | Wed Jul 16 12:13:27 EDT 2014 | deanm
Thank you for your comments so far. I believe I threw some people off by my wording. Clarification: How feasible is it to run a board straight into the reflow oven without inspecting it first for any placement defects? Is nudging parts and performin
Electronics Forum | Wed Sep 22 10:33:17 EDT 1999 | Boca
| which is the best way to catch defects online? | In circuit Tester or Vision System | Carlos, It depends on the defect you're trying to catch. Vision systems can be good at catching missing, reversed, wrong (if marked) parts. ICT is good with el
Electronics Forum | Wed Dec 17 17:09:03 EST 2003 | Gabriele
Clean or No Clean Solder Paste
Electronics Forum | Sat May 04 12:43:48 EDT 2019 | davef
ISO/TS 16949 is a quality management system for automotive sector
Electronics Forum | Tue Jan 18 20:31:10 EST 2000 | WDavidson
It makes a difference what the normalizer is. We calculate solder ppm and placement ppm separately for each assembly. Solder ppm = #solder defects*1E6/(Qty boards*#solder joints per board). For us this number is easily less than 50 and sometimes
Electronics Forum | Thu Oct 02 15:34:08 EDT 2014 | arifa_anees
the data collected from a standard SMT process is typically very noisy due to the natural.Initially, the most common evaluation method was placement yield.Offset Placement After Solder Screen-printing can reduce or eliminate these defects through cor
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Sun Sep 21 15:48:48 EDT 2014 | gascon5383
Our company has a process standard that requires a double person check at the beginning of every run (size of run is irrelevent, whether 20 panels or 500 panels). Every changeover that occurs a first piece inspection is made before reflow. If all is
