226 ipc-cm-770 0 results

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Selective Soldering Process

Laser Direct Imaging of tracks on PCB covered with laser photoresist

Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity

"Green" Nanocomposites for Electronic Packaging

Sustaining a Robust Fine Feature Printing Process

Sustaining a Robust Fine Feature Printing Process Sustaining a Robust Fine Feature Printing Process With the introduction of 01005 chip components and 0.3 mm pitch CSP devices, electronic component packaging is pushing surface mount technology

Defect Coverage for Non-Intrusive Board Tests

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages

Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages Drop Impact Reliability of Edge-bonded Lead-free Chipscale Packages This paper presents the drop test reliability results for edge-bonded 0.5mm pitch lead-free chip scale

Strategies for Designing Microwave Multilayer Printed Circuit Boards Using Stripline Structures

Dross and the Selective Soldering Process