Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
Electronics Forum | Thu Apr 09 18:02:03 EDT 1998 | Ron Beasley
| Has anybody heard of a shield to shield the cutter from | flying leads during hand cutting of through hole components. | If it collected the leads also that would be helpful. | I am thinking of plexiglass or something that the board | could be plac
Electronics Forum | Wed May 11 08:41:46 EDT 2005 | Rob.
Cheers Jerry, forgot the most important one! Also want it to do: laser 3D volumetric solderpaste inspection Pre-reflow (including fault logging by placement machine & individual feeder) Post reflow solder joint inspection & handle lead free joints
Electronics Forum | Thu Aug 19 22:59:48 EDT 1999 | Jeff Ferry
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Fri Aug 20 09:33:51 EDT 1999 | Don Morgenstern
Earl & Jeff Our machine is different than the Electrovert Solder Pak in that it is does not behave like a "volcano". Jeff, please contact me if you have safety concerns as perhaps you also want to consider our equipment. | | I'm trying a second ti
Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph
Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they
Electronics Forum | Thu May 07 11:39:29 EDT 1998 | Dave F
| Is there a machine for bending S shaped bends in leads | of through-hole components, to keep them off the surface of the board. Ryan: Some lead forming equipment can form leads to stand-off the board. Some lead forming equipment suppliers are: Au
Electronics Forum | Wed Aug 11 15:48:54 EDT 1999 | JohnW
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
