Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Wed Sep 24 08:34:57 EDT 2003 | stefwitt
Even when you run a board several times, the machine may not make the same travel path every time. This in itself does not create a problem, but the vacuum on the nozzles could be different, dependent on the configuration of components on the heads.
Electronics Forum | Tue Apr 13 18:57:57 EDT 2004 | TWegrzyn
Does anybody have any experience with PSA 2668 high shear cover tape on Fuji QP242s/QP351s feeders? Does it perform comparable to PSA 2666? We are looking to implement PSA 2668 due to some cover tape 'pop-off' issues with our Siemens HF machine, bu
Electronics Forum | Fri Jun 03 10:15:14 EDT 2005 | PWH
We do both our ovens once a week. If something looks out of tolerance (we've developed acceptable tolderances based on many recorded profiles over time and oven mfg. specs.) we wait a couple hours and try again. The recorded data over time is very
Electronics Forum | Wed Sep 21 18:09:03 EDT 2005 | PWH
We've had parts jump off pads on occasion due to panels or boards that are restricted in a carrier during reflow. The boards/panels expand and the restriction causes them to warp thus popping parts around during cool down. Doesn't sound like your p
Electronics Forum | Fri Mar 31 11:46:57 EST 2006 | fastek
Larry- I notice most of your posts either start out or end up like ......."I don't know anything about this, but there was a guy that worked here and he told me"...... WTF? You're not bringing anything to the table when you make judgements/opinion
Electronics Forum | Wed May 10 08:41:19 EDT 2006 | russ
Yes, we added some soak, we also use a 5 zone oven. We utilize a .020" x .020" pad with center to center at .042". We only get tombstones on misplacement or bad paste release now. Registration of component is key with pbfree, the parts just don't s
Electronics Forum | Tue Jun 27 14:40:41 EDT 2006 | pms
SrTech, Thanks for popping in. Your MyData advice has always been good. Anyway, all of our TM8FC's do have the correct seperators. So nix that. I thought the timing only had to do with advancing and stopping the component into the pick line correctl
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Thu Jul 27 12:49:39 EDT 2006 | SWAG
We use same methods of PCB attachment to carrier as Rob lists. To be more specific on pocket size, we machine our durostone carriers so there is 0.010 inch gap around perimeter of board. This might seem like a lot but (from my experience) you will
