Electronics Forum: size (Page 164 of 349)

Begenner

Electronics Forum | Thu Nov 30 11:37:38 EST 2000 | Reno Cassar

I am electronic hobbyist, which has made a prototype for electronic lock. On showing this to a company they become greatly interested. All the Smt for the prototype were placed manually on the prototype. I would like to set up a line without any huma

Re: Accepting Stencils

Electronics Forum | Fri Nov 17 05:40:48 EST 2000 | Wolfgang Busko

Hi Dave, I think your approach is more than some others do as incoming inspection. We just look for - damage of any kind - measure the thickness - measure a critical aperture for the correct size (reduction) - look for smooth walls - do Earls "look

Re: Press-Fit

Electronics Forum | Tue Nov 07 11:14:11 EST 2000 | Adam

There is a variation on the pins that come through on the other side. The pins that are deforming are roughly half the size of those which aren't deformed.There are no witness marks on the pins that are deformed, suggesting that the pins aren't fouli

How to do with tombstoning for component '0402'

Electronics Forum | Tue Oct 31 20:42:56 EST 2000 | speedy-tech

Now we are face with tombstoning for component '0402',we have tried many ways,it seems no change,Below is our experient: 1,The thickness of stencil is 0.12mm,and the aperture is circle.the diameter is 0.55mm.The pads size is 0.5*0.6. 2 Ch

BGA rework

Electronics Forum | Tue Oct 31 19:56:18 EST 2000 | Massimo

I'm reworking BGA with a "SRT Summit 2000". This machine uses a nozzle of the same size of the BGA to conduct nitrogen to the top of the BGA. When I rework big PBGAs (318PBGA, 388PBGA) I've got shorts at the corners (100% of the times!). I think the

Re: BGA Assembly

Electronics Forum | Tue Oct 17 18:10:05 EDT 2000 | Philip A. Reyes

Yes, you need to conduct X-ray inspection for BGA-SMT assembly, but it doesn't mean 100%. If your process is well capable and robust you can do sampling. There is an available X-ray machine that right now Iam assessing, cause we are going to buy one.

Re: 16 mil pitch QFP solder bridge

Electronics Forum | Sun Oct 08 00:18:05 EDT 2000 | Arturo

We are working with a 16mil TSOP Land width=0.2mm(8mil) and use: 1.Type 4 particle size solder paste. 2.Laser cut electropolished stencil: Aperture width=0.19mm (we tried lower than this but had solder insufficiency). Thickness=0.005"(130 microns)

Re: Water Soluble Paste Woes

Electronics Forum | Fri Sep 29 15:33:47 EDT 2000 | Dave F

5 Paste sticking to squeegee: Squeegee is heavily magnetized Some pastes stick more than ... Plastic squeegees stick more than metal Old metal squeegees stick more than new Paste needs to be worked Paste needs to be at room temperature Some fl

FR-2 against CEM-1

Electronics Forum | Mon Sep 25 07:35:04 EDT 2000 | Mikel Rodriguez

Hello, We are using FR-2 in boards 15x10cm size, with SMD and thru hole components (about 100 SMD and 50 thru hole). We have some "rare" problems (flex cracks or caps, diodes, and so on). Would we improve something by using CEM-1 instead of FR-2?? Mo

BGA assembly and inspection

Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung

Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass


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