Electronics Forum | Tue Apr 04 06:22:07 EDT 2000 | Neil Stoddart
Help. We are moving to a no clean solder paste and have the following concerns regarding solder balls. What standards are currently being followed concerning solder balls on SMT assemblies? Are these standards realistic and can they be easily achie
Electronics Forum | Tue Apr 04 07:46:03 EDT 2000 | Donnie
Neil, We currently use only visual inspection with a magnified lamp and actually brush the board after the wave process to help knock off any solder balls. You wanna use an ESD sensitive brush material. Camel hair is what we use. It works real wel
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Mon Mar 06 17:17:13 EST 2000 | gary
I need a little help with RF and Rogers 4003 board material. My background was in digital and now I need to set up a new line to make small RF products (.5" x .5" or smaller). I want to find out about board platings, finishes/maskings and reasonable
Electronics Forum | Fri Mar 03 09:48:06 EST 2000 | Wolfgang Busko
I have heard about it. The main reason is to save money. The problem is, or better is said, that the mixing isn�t that simple for you got have a homogen paste afterwards and the solderballs shouldn�t be deformed in size so that problems during printi
Electronics Forum | Thu Mar 02 18:15:01 EST 2000 | Stu Leech
How is the component marked. Is it ink marked, laser marked or what? What is the material that the marking on? What volume are you looking at? We used a small, pencil-sized sand blaster, loaded with bicarbonate of soda to errode the mark off of plast
Electronics Forum | Mon Feb 28 11:53:08 EST 2000 | Wendy Casker
Charlie, There are 2 ways to go and they both work. 1. Add thieving pads of the same size and pitch to all 4 corners 2. Make the exisiting 4 corner pads "doublewides" Both ways work. I like #2 because you don't get a bridge. Even though a bridge
Electronics Forum | Mon Jan 15 13:19:41 EST 2001 | johnthor
Hello Brian It seems that the ad size was an anomally that only appeared the first time I logged on to the new site. They were literally twice as wide as they are/were and pushed the text off the screen. Now it is as it was. I do like the fact that
Electronics Forum | Wed Jan 31 17:04:22 EST 2001 | williamh
Hello all, I am having a problem with solder balls on chip resistors and chip capacitors. I have searched the archives and found some information concerning solder balls but have a couple more questions. 1. What is the realistic industry standard f
Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre
I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th
