Electronics Forum: size (Page 167 of 349)

solder stain on gold finguers

Electronics Forum | Fri Feb 23 10:07:32 EST 2001 | jmlasserre

I would like to have some advise or explaination about the IPC610 spec. Page 6-51 and 6-52 concerning the solder stains on gold finguers: On the page 6-51, it's recommended to inspect the gold finguers with the unaided eye, but on the page 6-52, th

60 Deg or 45 Deg Blades

Electronics Forum | Tue Mar 06 09:28:30 EST 2001 | davef

You're correct 45� is preferred. 5 Paste sticking to squeegee: * Squeegee is heavily magnetized * Some pastes stick more than ... * Plastic squeegees stick more than metal * Old metal squeegees stick more than new * Paste needs to be worke

Contract Manufacturer's warranty policy

Electronics Forum | Mon Mar 19 11:44:22 EST 2001 | sac

My company is a small to mid size contract manufacturer, and relatively new to the business. I was wondering if anyone could tell me what a typical warranty policy is for PCB assemblies. In an effort to get needed sales, I am afraid our sales departm

Training Benchmarks

Electronics Forum | Mon Nov 27 11:22:37 EST 2000 | Dave F

Please benchmark training given by electronic board assembly companies according to: * Style (eg, classroom, OJT, off-site, etc) * Type (eg, job, safety, environmental, quality, etc) * Size of company (eg sales, GT $500M, LT $500M but GT $50M, LT $50

Re: Solder Phase Equilibrium

Electronics Forum | Thu Aug 24 17:08:58 EDT 2000 | Dr. Ning-Cheng Lee

Depending on the stress condition experienced by the solder joints. For joints under a greater stress, the time to reach equilibrium can be shorter. Of course, the change is also more significant in phase structure. For low stress conditions, it may

Large SCI

Electronics Forum | Tue Jun 06 13:02:44 EDT 2000 | eott

Charles, I am senior engineer in the environmental test lab for Agilent Technologies(HP Spin off). I am working on qualifying a large SCI(Solder Collumn Interposer) CBGA package. The package is 1mm pitch. The balls are .72mm. The number of balls ar

Pad design for SMD Bottomside wave soldering

Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH

Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t

Hardware Torque requirements

Electronics Forum | Mon May 14 08:41:11 EDT 2001 | jackofalltrades

Howdy, This subject may be a little off subject, but I have been looking for a source that can give me info for the recommended torque on hardware. What I would love to see, is a chart that can show me, for example a column for the screw size (SAE &

Hardware Torque requirements

Electronics Forum | Wed May 16 14:33:36 EDT 2001 | John

The size/type of screw and its preloaded torque are determined by the type and intensity of the load being applied to it. This should be known or estimated by the engineer that designed the product. Then they'll typicly apply a large safety factor

Can local fiducials improve BGA placement?

Electronics Forum | Wed Jun 06 16:51:06 EDT 2001 | jax

Unless your placing micro-bga, board edge fiducials on alternating corners will provide more than enough placement correction ( Micro-bga's should also be fine depending on how your equipment maps the board ). The part data and vision recognition nee


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