Electronics Forum | Thu Jul 26 13:49:48 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Thu Jul 26 14:06:46 EDT 2001 | johnmaetta
That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th
Electronics Forum | Tue Jul 31 00:48:55 EDT 2001 | Frank
Sorry I forgot to provide enough information. Stencil thickness is 6 mil Aperture width is 10 mil Aspect ratio (aperture area / wall area) = 0.72 Solder paste mesh size, type 3 (-325 +500) With this aspect ratio we can printing without any probl
Electronics Forum | Mon Jul 30 10:44:37 EDT 2001 | hinerman
A few of the more common defects If bridging or insuffienct deposits occur on the printer, one of the first things to check is the tooling. Misplaced hard tooling pins or poorly designed fixtures have a nasty habit of breaking components on side
Electronics Forum | Tue Jul 31 20:12:01 EDT 2001 | davef
If you've told your experts in Germany and US as little as you've told us, I'm not surprised they don't know dip. Sorry, I just snapped there for a moment. That wasn't politic, was it? Yes, it is possible that the other solder connection on this c
Electronics Forum | Mon Aug 06 10:33:32 EDT 2001 | Hussman
Hi Pete, Wow, I figured you'd have tons of answers to this one. Anyway, call the vendor of the adhesive you are using and see if they have a cleaner for their adhesive. Most do now. Just make sure the SMT pads and vias do not have any adhesive on
Electronics Forum | Tue Feb 08 14:49:23 EST 2000 | Travis Slaughter
I have never tried this and wouldn�t really even want to consider it. Epoxy generally cures at around 160c in a fairly short amount of time, solder paste requires much more time and a peek temperature of about 210c or more in some cases. Curing you
Electronics Forum | Wed Feb 02 20:39:07 EST 2000 | Dave F
AF, Buddy: I know someone "set you up" to ask this question, but: 1 What kind of "thermal excursions" are you interested in? Solder cycles, rework cycles, thermal shock, thermal cycling ... 2 What are you talking about boards, components, assembl
Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Fri Jan 21 05:18:55 EST 2000 | Dean
If at all possible avoid mirror assembly BGA designs. It has a higher failure rate when compared to non-overlap designs (life testing). In addition, from a rework point of view, X-ray inspection yields no help when a failure occures. You can't det
