Electronics Forum | Tue Oct 26 08:17:54 EDT 1999 | William
Dave, Last question(s). What do I do about a gold porosity problem? Dave: How would I approach the board house to check for this? They use a very well known chemistry, but is that where the pblm lies? Or would it be in their process, cycle times
Electronics Forum | Fri Oct 22 21:23:59 EDT 1999 | se
Tombstoning is usually oven profiling, see October 14 thread below. Aperture rules are misleading. Component mix, stencil thickness, paste factors, all contribute. Also, are you making the stencil from a paste or pad layer or from a soldermask layer?
Electronics Forum | Fri Oct 22 07:24:11 EDT 1999 | Chris May
We are not into BGA Tech (yet !), but I was discussing other issues with a knowledgable individual, who said that they do not reball BGA's. What they do, is to have a piece of glass, apply some flux to the glass and then drag the BGA across the glas
Electronics Forum | Thu Oct 21 11:32:15 EDT 1999 | John Thorup
Larry Elaborating on the specific question, yes, the volatile solvents in the flux can and will evaporate. Evaporate completely in any reasonable amount of time? Probably not. What tends to happen is that the exposed paste dries on the surface and
Electronics Forum | Fri Oct 22 10:35:56 EDT 1999 | Graham Naisbitt
Armin, I can supply you but wont. Why not? Because these materials have a short shelf life when packed into syringes. Your local supplier should be able to provide them but he will be obliged to make up a batch of 2 - 300 to be economical - but they
Electronics Forum | Wed Oct 20 16:55:26 EDT 1999 | NickMata
Hello all, I am trying to get some information on ENTEK CU56. I am planning to use 310M flux on ENTEK 56 cards. It will not be a double reflow (top/bottom) followed by wave. I plan to reflow, glue/cure then wave. I am concerned about burning off the
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Tue Oct 19 17:52:47 EDT 1999 | John Thorup
Hi Carol You can use a threaded standoff and put a screw through the board and into the standoff with the screw from the buss bar coming into the other end of the standoff. You should use a SEMS type screw or a internal star type lockwasher with a pl
Electronics Forum | Mon Oct 18 09:41:56 EDT 1999 | Wolfgang Busko
That should not happen. There are some threads concerning BGA and wavesoldering you could look for. It�s said that you should protect the vias in the BGA-area by soldermask or at least with tented vias to prevent rereflow of BGAs solderjoints what co
Electronics Forum | Tue Oct 19 22:27:29 EDT 1999 | Stu Leech
We have just completed some studies of with ABPAC, who is a large subcontract assembler of plastic ball grid arrays. BT laminates can pick-up appreciable moisture in just two hours. They are using TVP demoisturizing, our product (I apologize for the
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