Electronics Forum: wet (Page 168 of 182)

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F

| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon

| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri

Re: Solder Joint Problem

Electronics Forum | Thu Jun 25 14:33:51 EDT 1998 | Chry

| Hi there Chris! | Are the leads you talking about fine pitch? Is the complete fillet attached to the foot, with it being cleanly separated from the pad? I bet if you look at the board there will be via's really close to the pads at the location

Re: PCB Standards

Electronics Forum | Wed Jun 10 18:40:00 EDT 1998 | Earl Moon

| I am looking for the Industry standards on vias. Are they required to be plated with solder or is copper plating enough? What about reliabilty with either one? Also, if tenting the via is required should it be copper plated or solder plated over

Re: reflow theta alignment

Electronics Forum | Fri May 29 13:42:34 EDT 1998 | Steve Gregory

Hi Jason! I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. If you have a board around that has some 1206 locations all in a row, print the board with paste and then plac

Re: reflow theta alignment

Electronics Forum | Fri May 29 16:12:11 EDT 1998 | Jason Gregory

| Hi Jason! | I can probably find something documented for you, but the easiest way to convince your QA people is just to show them. | If you have a board around that has some 1206 locations all in a row, print the board with paste and the

Re: Residue

Electronics Forum | Tue May 26 19:20:39 EDT 1998 | Graham Naisbitt

Ryan, Please consider the following: There is no such thing as no residue flux. Low or no solids flux contain "wetting" agents to help the stuff stick upside down! Try painting your ceiling with less than 2% solids paint!! With all this excess liquid

Re: Drying ICs any advice

Electronics Forum | Fri May 15 10:41:12 EDT 1998 | Dave F

| | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin pac

Re: Waving TSOPs

Electronics Forum | Fri May 08 18:39:17 EDT 1998 | Steve Gregory

| | As usual, we are faced with too many components and not enough board on a new design. Does anyone have experience wavesoldering .025" pitch TSOPs on the bottom side? | | Any advice is appreciated. | | Greg Hi there Greg! First, I just gotta

Re: Wierd Tombstoning on Tant Caps

Electronics Forum | Fri May 01 14:44:26 EDT 1998 | Earl Moon

| I've never seen this before. Today, I got this tombstoning on Tantalum Capacitors (Okay, I saw that before) | Here's the part that seems weird to me: | -They didn't tombstone onto a termination - they went onto their sides! That's right, both ter


wet searches for Companies, Equipment, Machines, Suppliers & Information

best pcb reflow oven

Component Placement 101 Training Course
Sell Your Used SMT & Test Equipment

Training online, at your facility, or at one of our worldwide training centers"


High Throughput Reflow Oven
Electronic Solutions R3

Low-cost, self-paced, online training on electronics manufacturing fundamentals