Electronics Forum | Wed Aug 04 20:44:05 EDT 1999 | Peter
I am trying to program/run a test board on a CS-400C machine for the very first time and am having problems making it run right. I am programming and downloading this directly out of CircuitCAM software. After setting the origin on the CS-400C and
Electronics Forum | Fri Aug 06 04:54:19 EDT 1999 | Scott Bradley
| I am trying to program/run a test board on a CS-400C machine for the very first time and am having problems making it run right. | | I am programming and downloading this directly out of CircuitCAM software. | | After setting the origin on the CS
Electronics Forum | Fri Aug 06 12:07:46 EDT 1999 | Robert Horowitz
Peter, Try calling Contact Systems for your answer. We can be reached at (203) 743-3837. Ask for the Field Service Dept. They can easily assist you. Regards, Robert Horowitz Sales Manager Contact Systems | I am trying to program/run a test boa
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Wed Mar 03 17:09:55 EST 1999 | Tom Reilly
We have recently had problems with bare boards coming in too thick. I would like to know how to properly specify the minimum and maximum thickness using the 13949F and IPC 4101 specs. (We currently use "MATERIAL: GFN 0620 C1/C1 A2A per MIL - P - 1394
Electronics Forum | Mon Sep 14 21:40:25 EDT 1998 | Stefan W.
Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for an
Electronics Forum | Tue Sep 15 14:12:36 EDT 1998 | Justin Medernach
| Unfortunatly there are too many variables to play with that you can't make a general rule for the vibration time. | However, I suggest you increase the vibration time and lower the vibration force ( AC voltage ). For an SO 8, I would use 600 ms for
Electronics Forum | Thu Aug 20 15:29:45 EDT 1998 | D. Lange
Re: Questions #2 Are you having solderability problems with that arrangement? Sounds like problems could be solved at the wave solder. If the customer has already spun pcb then sometimes for low volume it would be easier to correct the problem at wa
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
Electronics Forum | Sun Apr 05 18:59:15 EDT 1998 | Graham Naisbitt
Jaqueline There are so many variables in the electronic assembly manufacturing process involving more than 12 different chemistries, that it is impossible to easily identify and determine the nature and reason of such residues. GEC Hirst Research in
