Electronics Forum | Wed May 16 14:33:36 EDT 2001 | John
The size/type of screw and its preloaded torque are determined by the type and intensity of the load being applied to it. This should be known or estimated by the engineer that designed the product. Then they'll typicly apply a large safety factor
Electronics Forum | Wed Jun 06 16:51:06 EDT 2001 | jax
Unless your placing micro-bga, board edge fiducials on alternating corners will provide more than enough placement correction ( Micro-bga's should also be fine depending on how your equipment maps the board ). The part data and vision recognition nee
Electronics Forum | Fri Jun 29 13:54:43 EDT 2001 | Brian W.
I have had some conversations with MPM about the Rheo pump. They have some data to support the change from an ROI standpoint. One of their customers has seen a dramatic decline in the amount of wasted paste, resulting in a very large cost savings.
Electronics Forum | Mon Jun 18 11:23:44 EDT 2001 | Gil Zweig
BGA defects observed with x-ray inspection fall into catagories. One catagory is the obvious defects; i.e. soledr bridges, missing balls, excessive solder voids. The second catagory is the more subtle "potential" defect. This is where variations in
Electronics Forum | Tue Jun 19 12:15:45 EDT 2001 | Gil Zweig
I have made reference to X-ray Ball Bond Signatures a number of times, and I cannot overstate the importance of quickly qualifying the overall ball bond pattern as either uniform in size and shape or not. Software is available that will make this qua
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Mon Jun 18 19:32:58 EDT 2001 | Gil Zweig
I believe that at the present time the industry really does not know how to use x-ray inspection apart from indentifying the obvious defects such as shorts, missing balls and gross solder voids. The real utility of x-ray inspection is to recognize: 1
Electronics Forum | Tue Jun 26 16:43:19 EDT 2001 | CPI
Yes a 6 mil solder deposite will reduce to approx 50% of it's original size. Does this happen on only 1 BGA? Is the BGA that its happening on have smaller balls than the others, what I'm getting to is, are you sure you are depositing the proper amo
Electronics Forum | Fri Jun 29 18:43:16 EDT 2001 | procon
Dear Danial, The only stupid thought is the one left only as a thought and not asked. The size of the board and the placement of the BGA on the board could play a big factor during reflow. If you are processing boards on an edge conveyor and the boa
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
