Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Fri Sep 13 10:59:35 EDT 2002 | Simon Davis
Hi Folks, This is a totally speculative, if not cheeky post. I know very little about electronics, but I think you guys do. I have a problem with my car radio, that I'd really like to solve, as I cannot buy a new one where I live (Brazil), and I th
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Fri Mar 16 17:22:47 EDT 2007 | Cmiller
James, I respectfully disagree with you. Rick, you are correct. Personaly I liked that Universal published prices for their machines a few years ago. Im not sure if they still do and there may still be "deals" to be made. If someone was buying ten of
Electronics Forum | Tue Dec 01 17:50:43 EST 2009 | swag
This is cut and paste from a Conceptronics Document - hope it helps you: Following are the lubricants recommended for oven maintenance: 1. To lubricate the conveyor chain use: A. Biral BIO30 -synthetic high temperature oil (highly recommended)
Electronics Forum | Tue Mar 29 04:15:01 EDT 2011 | ravo
Dear All, Thank you so much for your cooperation. Actually am in continous problems with my BGA and can not assemble it using my QP242 till now, I am using the following data : Vision no. : 1 Vision Type: 230 Height: 2.32 Body Size X: 27.00 +-0.
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Mon Nov 09 09:44:22 EST 2015 | davef
Purpose. This describes setting-up a wave soldering system set-up for a new assembly design or checking a wave solder machine operation with a test board. Applicability. To be used for new design printed circuit assembles and during machine accept
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
Electronics Forum | Wed Jul 22 12:47:23 EDT 1998 | Earl Moon
| I'm trying to put together a set of design guides for use for new designers | in house or to be sent out for contracted layout work. I would like to start with a top ten list of things that will go wrong if rules aren't available. For example testp
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