Electronics Forum | Tue Mar 04 17:06:31 EST 2008 | realchunks
Depends on your board? What finish? Solder mask between all pads? What pitch is the part? Will it machine placed? Don't forget proper profiling as well. 1:1 with machine placement should yield no issues.
Electronics Forum | Mon Apr 14 21:43:04 EDT 2008 | joseph_gonzales16
Your problem is process you need to eliminate and there are so many causes to considered. 1.your solder paste 2.your PCB pads 3.your component 4.your profile 5.your printer 6.your placement. you need to isolate all these one of this is your problem.
Electronics Forum | Wed Apr 16 09:02:09 EDT 2008 | tonyamenson
One issue stated incorrectly was that the work order that had no problems, with the same layout and same parts, is a one up at SMT. The problomatic units are two ups. I know the first instinct is to say the profile, but we have run this assembly man
Electronics Forum | Wed Apr 16 09:30:09 EDT 2008 | swag
IPC-7530 might help some but will cost you a little. We have an older OmniFlo that has a pretty good section on all that in the manual if you happen to have one of those.
Electronics Forum | Thu Apr 17 07:46:22 EDT 2008 | cyber_wolf
CK, I agree with you 100%. I mentioned this to one of my managers....... But, that is what they want. Alll....righty....then...
Electronics Forum | Thu Apr 17 12:27:56 EDT 2008 | samir
Sr. Tech: Here is a decent article by Phil Zarrow: http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Archives⊂section=Display&ARTICLE_ID=80850
Electronics Forum | Thu Apr 17 20:29:35 EDT 2008 | lellis
Follow the traveller as per a engineer there shouldnt be a issue. If the engineer isnt correct the operator isnt to blame, unless they are not following the traveler or paying attention to parameters. Is the messenger to blame, who sent the message?
Electronics Forum | Mon Apr 28 11:13:21 EDT 2008 | ck_the_flip
Here's a crude wettability test. Take a PCB - both types of finish - print them, and reflow with no components using your standard profile. Observe the wetting spread and flow of the solder paste. This rules in/out that it's PCB solderability.
Electronics Forum | Tue May 20 08:25:26 EDT 2008 | davef
Well something is different isn't it? * Paste * Part supplier * Board fabrication * Was the profile that you reference the measured temperature or the the settings keyed into the oven? The cross sections seem to show less than expected ball collapse
Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
