Electronics Forum | Wed Dec 17 16:19:42 EST 2003 | swagner
How long are the OSP boards out of there packaging? Is this a double sided smd process or single? Are the boards stored in nitrogen? Sounds like an osp issue to me!
Electronics Forum | Mon Dec 22 12:41:17 EST 2003 | Marc Simmel
No clean solder paste. One further observation ... the parts have a metal shell and are 'floating' high on the paste. Though there is wetting on the metal shell, it doesn't seem to sink as far as it should and this could be lifting the soldertails f
Electronics Forum | Mon Dec 22 12:49:19 EST 2003 | Marc Simmel
The boards are vacuum packed in quantities of 50 pieces and used within an hour or two of opening; no nitrogen storage. The boards are processed in a double-sided smd process.
Electronics Forum | Thu Jul 10 08:18:15 EDT 2014 | emeto
I think what you are asking for is called First Pass Yield and for us that is in the upper 90s. It will depend on the board complexity and quantity - makes big difference if you run 10pcs or a 10000pcs. Regards, Emil
Electronics Forum | Fri Jul 18 04:58:33 EDT 2014 | alexeis
Hi, If you are working in high mix low volume, your machine time is very expansive. In this case you must rely on the programmer, people experience, and make preparations offline (like Setup etc.), so do not hold the line in vain. Best Regards, Ale
Electronics Forum | Mon Mar 08 20:39:03 EST 2021 | tey422
For boards that would need the conformal coating process, you would need to have them as clean as possible; especially the no clean process
Electronics Forum | Wed Mar 10 16:48:13 EST 2021 | rsatmech
Below list based on my observations. Nozzle block Sensor block Insufficient issue in printing Solderability issue due to fod
Electronics Forum | Mon Mar 15 01:38:46 EDT 2021 | researchmfg
Thanks for the answer. Did you really find the dust block the nozzle and sensor? By the way, If SMT environment need to control the dust then what size of dust need to be controlled? 0.3um, 0.5um or 10um?
Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Mon Dec 22 19:43:43 EST 2003 | Dean
I have seen this affect on Immersion Tin and OSP. 70 to 90 % of the solder wicks to the lead and forms a "single" homogenous solder mass. This even though the pad was 100 % covered with paste... Evaluated different solder paste...did find variatio
