Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Fri Nov 04 01:24:53 EDT 2011 | kevintough
From what I have seen of the Omron software your most interesting challenge and prerequisite for a clean and complete inspection is a full understanding of the color triangle and it's settings. I know you can find almost the same interface/GUI in the
Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Tue Mar 21 20:33:09 EST 2000 | Dave F
Shane: We don�t dispense, but we have thought about it. Several points about peelable solder masks in a no-clean (low residue) process: � Beware of latex peelable solder mask with a low res process without extensive testing. The problem is usuall
Electronics Forum | Sat Oct 10 04:58:18 EDT 1998 | Tony B
| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/
Electronics Forum | Wed Aug 08 21:24:52 EDT 2001 | davef
First, not that it�s bad, but SM-782, the land pattern standard is a pretty far distance from a DFM check list. Now, if you�d said D-275 er more properly 222X, ama be twitchin� less. Second, your process should include two distinct elements: 1 Data
Electronics Forum | Thu Apr 11 14:31:15 EDT 2002 | aaelect
We're having some problems with 0402's tombstoning. On a board with about 300 parts we're getting about 12 to 20 tombstones per board. The caps seem to do it more often than the res. The pads appear to be in accordance with IPC SM 782 amendment 1, S
Electronics Forum | Fri Jun 21 15:04:51 EDT 2002 | bentzen
Hi Greg. FujiCam has two ways of calculating the placement coordinate for a component. - The "FujiCam/Unicam way": calculating component origo as the center of the designed component pads. - Use the PCB designers part origo which could be center of
Electronics Forum | Mon Sep 11 04:10:46 EDT 2000 | Jim Arnold
I spent 25 years operating my own hybrid shop working with surface mount components, soldering materials and procedures. Dealing all the while with it's associated surprises and problems such as yours. Now-a-days I get paid to investigate and attemp
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