Electronics Forum | Thu Mar 07 17:16:23 EST 2002 | JTorres
Dave, Yes the process is in control or that part that we can control. Visual inspection on first boards and then after a batch. I have had good prints with our current printing machines. My operators are very conscious of there work. Quality control
Electronics Forum | Wed Mar 20 16:17:35 EST 2002 | Fuji Spares
Both My Employers and myself have bought Microsoft access custom designed database Applications from Technology Media, Bradford (www.tekno-media.com) The databases were for engineering change notes and also a customer returned goods data tracking pro
Electronics Forum | Fri Apr 05 12:09:51 EST 2002 | davef
Conductive Silver Epoxy Holefill Process Dupont CB100 (Note: Dupont Recommendations) * Board Thickness: 0.008" to 0.085" * Drilled Via Size: 0.008" to 0.018" * Aspect Ratio: 1:1 to 6:1 On learning more, try: * http://www.ipc.org/html/S17-4a.pdf * Du
Electronics Forum | Thu Apr 25 23:13:24 EDT 2002 | ianchan
Hi Dave, Bbbaaa....*note the sheep eyes*....bbaaa.... ok, that was a great wakep up rap! I'll relay that strongly worded paragraph to the calibration in-charge, see what he has to say for himself? thing is, such situations reflects on us as a whole
Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon
Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta
Electronics Forum | Wed Jun 19 08:51:49 EDT 2002 | davef
Try this: * Remove PTH components that cannot resist baking like, plastic sockets & electrolytic capacitors. [NOTE: It may be econonomic to sacrifice some of the PTH components that cannot resist baking.] * Bake the board. * Remove, reball, and repla
Electronics Forum | Wed Jun 26 21:31:42 EDT 2002 | ianchan
Hi mate, suggestion: consider "re-fridge" the paste after each Lot (small volume) batch run, instead of leaving it at ambient temperature for 3mths. follow FIFO control of such re-fridged paste. check with your supplier (in documented format reply)
Electronics Forum | Mon Jul 29 21:26:23 EDT 2002 | caldon
Just a small note...KNS Subcontracted an advanced placement machines and bonder from Datacon (Austria). With KNS moving all of their equipment production over seas Datacon (Also thought it was time to go direct)went direct in the US market. Datacon
Electronics Forum | Fri Jan 17 16:36:04 EST 2003 | MA/NY DDave
Hi As DaveF notes there are many sources. In one of my lives, I used to generate this business for one of the really good outfits i.e NTCu in Bethlehem, PA and I know of several more. You probably already get NTCu's mailing if you have been in the
Electronics Forum | Tue Feb 11 11:16:46 EST 2003 | Chad
I believe I've seen some board houses advertise the ability to plate vias completely shut, so that they can be placed within the outlines of a pad without causing the problems you noted. I've seen this scheme used on very densely populated digital bo
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