Full Site - : pad size (Page 18 of 208)

ILJIN Vacuum Loader AVL-60S

ILJIN Vacuum Loader AVL-60S

New Equipment | Board Handling - Conveyors

This unit is used for removing dust, particles, glass fiber & etc on bare PCBs surface. • SMEMA Interface • For bare board • PCBs placed at front • 3-color LED light tower • Buzzer • Safety full cover • P

A-Tek Systems Group LLC

Star Werks, INC

Industry Directory | Manufacturer / Other

OEM Contract Manufacturer, Prototype production, battery testing, quick turn production, high/Low volume production. OEM products, complete box build, sub assembly, battery chargers, power supplies, microphones, cable and flex assembly.

How To Design Cost-Effective PCBs

Industry News | 2018-10-18 11:19:07.0

How To Design Cost-Effective PCBs

Flason Electronic Co.,limited

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC - Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

Videos

Manufacturer of Printed Circuit Board from PCB Design, Layout, PCB fabrication & PCB Assembly.

PNC Inc.

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Industry News | 2018-10-18 08:34:52.0

How to Prevent Solder Bridging in 3528 PLCC6 RGB LEDs?

Flason Electronic Co.,limited

SN100CL Minimum Thickness Guidelines

Industry News | 2008-09-10 09:31:07.0

Saturn Electronics Corp. Providing Criteria for the Industry

Saturn Electronics Corporation

Fill the Void V - Mitigation of Voiding for Bottom Terminated Components

Technical Library | 2020-12-29 20:55:46.0

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).

FCT ASSEMBLY, INC.

Practical Components Supplies NEWLY UPDATED AIM Print Test Board and Kit

Industry News | 2010-04-10 23:59:50.0

LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.

Practical Components, Inc.


pad size searches for Companies, Equipment, Machines, Suppliers & Information

Electronics Equipment Consignment

High Precision Fluid Dispensers
PCB Handling Machine with CE

High Throughput Reflow Oven
PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications
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