Electronics Forum | Thu Oct 23 04:19:15 EDT 2014 | garteaga
Our reflow oven builds solder on one specific panel type. It will have solder buildup inside the oven. We then end up with small solder balls on our panels. We think it may be the solder paste, the screen printer is leaving a clean wipe under the pa
Electronics Forum | Mon Jun 25 20:54:28 EDT 2001 | davef
No, I�m suggesting an increase in the distance between the two pads on the board. This "G" in SM-782A "Surface Mount design & Land Pattern Standard" parlance. You shouldn�t fight solder balls for long periods. You should just increase the pressure
Electronics Forum | Thu Mar 19 15:01:00 EDT 2020 | emeto
Overprinting until the solder paste start detaching from the joint and start forming solder balls. Based on finish, chemistry and type solder mask this number will be different.I also wouldn't call it "better solderability".
Electronics Forum | Wed Apr 04 12:35:15 EDT 2001 | davef
These solder balls are where [top / bottom]? Describe the breadth and degree of this problem across all assemblies. Finally, describe your wave solder machine, a common profile for this board, and the board [beyond that it's mixed tech, like are
Electronics Forum | Mon Dec 13 18:17:44 EST 1999 | Calvin Wong
We have this solder ball & beads around chip components since day one of manufacturing using non-clean process. We managed to eliminate the solder beads around ceramic type chip componenets when we have a slow ramp up of pre heat at solder reflow. Ho
Electronics Forum | Thu Jan 20 13:56:51 EST 2022 | stivais
For me it seems that the board is already assembled & soldered. Before assembling the board had been (poorly) washed (misprint perhaps) and the spots are just melted solder paste. Aren't those solder balls in the grooves between the pads and solder
Electronics Forum | Tue Nov 27 19:52:08 EST 2001 | davef
Search the fine SMTnet Archives on the topic to get started. For instance: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=1861&#Message7671&
Electronics Forum | Thu Aug 05 13:33:22 EDT 2004 | davef
For the �The Chip Wave Dilemma", look here: http://www.alphametals.com/products/fluxes/PDF/dilemma1.pdf
Electronics Forum | Fri Aug 25 09:25:41 EDT 2006 | YQ Deng
For FR4 ENIG PCB: 1. In a normal condition, what is the broken location after BGA peeled off?(FR4 layer or Ni layer or solder ball) 2. What is the soldering acceptance criteria for BGA in CMK?
Electronics Forum | Mon Jan 17 21:01:21 EST 2000 | Dave F
Dennis: On your BGAs: * Never seen voids any place other than the top ... lower density stuff rises. * Our spec on voids says: 1 Voids 1a Voids in soldered balls shall be less than 20% of the diameter of the solder ball. 1b No void shall sho
