Electronics Forum: 10 (Page 1741 of 1925)

Re: Coplanarity on fine pitch QFP

Electronics Forum | Tue Sep 26 09:27:10 EDT 2000 | Chris May

LarryK, It all depends upon your volume / problem. As Jax says, if this is a repeating problemo, get QA & Purchasing involved. Is it your stores ? Do they receive 100 off and "decant" 20 into a tube (manual handling error, training etc;). From your

Re: Capability Study for Solder Printing Process

Electronics Forum | Sat Sep 23 15:13:40 EDT 2000 | Francois Racine

Hi Sophia, I`m responsible of SMT line and we solved this problem with a complete automatic solder paste printer machine. In the past we had problem with off alignment and solder height too.... at that time we used a semi-auto printer machine and w

Re: Capability Study for Solder Printing Process

Electronics Forum | Tue Jan 23 22:38:43 EST 2001 | rpereira

I have recently completed a HUGE screen-printing DOE. I used Taguchi methodology and man I got good results! Here is what I learned for what it's worth: (p.s. to the MPM apps guy I sent a copy to Tim Gillis, Lou Fuda, etc...) EFab vs. Laser: EFab

Re: CTE mismatch

Electronics Forum | Fri Sep 15 16:37:49 EDT 2000 | Dave F

Sounds like someone aimin� fo tha big hurt, if ya axes me. Two spots to place your lawn darts are: 1 J Hwang in "Modern Solder Technology � " states (p.354) that " � extreme CTE mismatch between silicon IC (~2) and the PCB (~16), solder connections

Re: Daughter Board Attachment??? Help!

Electronics Forum | Tue Aug 22 10:22:59 EDT 2000 | Wolfgang Busko

Mark: The fact that these daughter boards have to be attached to the TSOP-footprints is what makes the thing difficult cause they will be greater than the original part. One could think that a LCC-design allows for proper routing. But when it comes t

Re: Barcoding Component Reels

Electronics Forum | Wed Nov 01 12:10:20 EST 2000 | Jeff

charles, i can appreciate the hand held "reel to reel" scanner as a good solution that is very cost effective. during my smt supervision days we had a number of part loading checks. 1. load plan check, 2. scan check, 3. reel to reel manual check.

Re: SPC?

Electronics Forum | Mon Aug 14 18:24:36 EDT 2000 | Dave F

James: Here's a starting point: 1 www.wwnet.net/~rkroy/wp-inb.html 2 www.sas.com/otherprods/jmp/Home.html 3 www.micromeg.com/ 4 Boeing SQC (avail. from Boeing for $100) is a good little package for DOS machines. 5 For Windows, SPC KISS from Air Aca

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: Component solderability problems TO263 package

Electronics Forum | Thu Aug 10 12:14:12 EDT 2000 | Charles

It looks like a giant dpak device but with 5 leads. The problem is that on approx 3% of our boards one more pins are open circuit. It appears that the pins are not in contact with the pads. Board is HASL finish IR oven Paste Koki 953i. If you have a

Re: Dark Pad / Gold Embrittlement?

Electronics Forum | Wed Jul 26 10:57:16 EDT 2000 | Steve Schrader

Doug, We've suffered through similar frustrations. One thing we found that might be of some help is uur supplier, unbeknownst to us, was outsourcing their immersion gold. Their supplier apparently lost control of their process for a period of a fe


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