Electronics Forum | Mon Jul 31 12:59:19 EDT 2006 | slthomas
Nothing like making a handful of changes all at once to confuse an issue, huh? Did you (or whomever ordered the stencil) spec. the same stencil design parameters that you would normally have used? We've never done fine pitch of any sort on silver
Electronics Forum | Mon Aug 07 17:03:45 EDT 2006 | Harry
What is the name of the dross eliminator you are referring to? Who is the manufacturer? I went to your website and didn't see anything about it? I just ordered some MS2 from P. Kay Metal as I've been hearing some very good things about it from longti
Electronics Forum | Thu Aug 17 10:30:08 EDT 2006 | Chunks
Hi McGill, The straight ramp is "straight" from the manufacturers of the material. Using old process techniques from your old process materials no longer applies. We all miss the good old days, but it�s time to move on. Being of Asian descent, I t
Electronics Forum | Wed Aug 09 01:58:51 EDT 2006 | tk380514
OK i have a question: I have a prototype BOM and i suggested the customer that we use Paste-in-hole for the 1 connector that they want to use, but its quite high component and not very wide: http://www.molex.com/pdm_docs/sd/022272051_sd.pdf If i u
Electronics Forum | Fri Aug 18 07:49:34 EDT 2006 | markb
Thank for the feedback everyone. The LED is designed to be soldered 2mm above the board, so that is their rational for allowing that much flash. And a spacer is not going to work because of the height limit of mating parts (I didn't design the boar
Electronics Forum | Wed Aug 23 12:14:15 EDT 2006 | jdengler
At a previous job we had a kit to splice the belts. It was a clamping and squeeze device and a soldering iron with a flat blade. You would cut the ends for a suare edge, put the belt in the clamp unit with a small gap. Use the iron to melt both en
Electronics Forum | Fri Aug 25 09:01:42 EDT 2006 | russ
We sire don't AJ, We use a single large aperture in center and the outer pads are just reduced our standard which is I believe about mil off of each side or 2 mils in X and Y. As far as side fillet, sometimes we get them sometimes we don't, I attri
Electronics Forum | Tue Aug 29 11:22:12 EDT 2006 | yuceltemel
Dear Bruce, We had the same problem in the same condition. Every compnent and the PCB (OSP) has changed as lead-free and we need to solder them with SnPb. For solution we have increased the flux amount applied on PCB and the pre heat zone temper
Electronics Forum | Wed Aug 30 08:59:40 EDT 2006 | saaitk
Our facility in Asia wants to change their solder paste to a local manufacturer. I have recieved specs for this paste and compared to our existing paste spec, there is not really much difference in material composition. The Asia spec tests the paste
Electronics Forum | Thu Sep 07 08:50:45 EDT 2006 | Grant
Hi, We have seen a slight rise in failures in a product, and on investigation, the BGA ball has cracked off the PCB. It's below the intermetalic layer in the ball. Reflow otherwise looks good, and the raw components are clean. I am wondering what c