Electronics Forum | Tue Jan 25 21:59:44 EST 2000 | Dave F
Michael: On reliabiliity, consider that: � IPC-SM-782, "Surface Mount Design And Land Pattern Standard" and IPC-D-279, "Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies" specifically describe via in pads as "poor des
Electronics Forum | Tue Dec 28 10:57:53 EST 1999 | Amy Castor
I have tried the water soluble flux and the aqueous cleaners but I got the same results you did; horrible corrosion and a white flaky mess. I know exactly what you're talking about. We do a lot of hand soldering around here, and the magical solutio
Electronics Forum | Fri Dec 17 09:47:10 EST 1999 | John O'Brien
Chuck: Your best resource is the Symbology Research Center in Huntsville AL. In is a research and development facility run by RVSI Acuity CiMatrix, the folks who invented the Data matrix (DM) 2-D code. This facility is unbiased as to technologies and
Electronics Forum | Mon Dec 06 04:48:53 EST 1999 | Charles Stringer
Greg This is one of the eternal questions. I have racked my brains over this one in many organisations. If you are a low volume user (as your run size of 100 to 1000 would indicate) then you are likely to loose more taped components from loading and
Electronics Forum | Fri Dec 10 08:44:52 EST 1999 | Dave F
Vinesh: You�ll find no papers that "clearly describes the harmful effects" of your style "of white residues," because no one is crazy enough to brag that they are doing what your customer wants you to do. The residue of no-clean fluxes are designe
Electronics Forum | Mon Dec 06 05:18:53 EST 1999 | Wolfgang Busko
Hi Russ, assuming that only your flux changed and the PCB-finish stayed the same it seems to me that the solderability of that finish is somehow poor. About Ni/Au it can be said that the solderconnection is made between Ni and Sn. The Au-finish is ju
Electronics Forum | Wed Dec 01 22:34:32 EST 1999 | Dave F
Mark: Ralph Woodgate is a "god" of solderability control programs. We have: � Been attending his seminars for, maybe 8 to 10 years ... who keeps track when you�ve been breathin� fumes that long? � Three different editions of his "Handbook Of Machi
Electronics Forum | Thu Nov 25 21:43:49 EST 1999 | cklau
Via is normally a plated thru holes in (0.63 to 1.0 mm (0.025" to 0.040") diameter lands , which unless properly treated they must be located away from the component lands to prevent the solder migration off the component land during reflow soldering
Electronics Forum | Thu Nov 18 10:56:16 EST 1999 | Dave F
Jacky: There�re major four factors that affect the reliability of a solder connection. 1 Design of the connection including the shape and height of the lead and the type and amount of solder. 2 Dissolution of base metals into the solder connection.
Electronics Forum | Fri Nov 26 09:13:10 EST 1999 | Wolfgang Busko
Jeff, Ted, Stefano What Stefano is saying sounds reasonable. With entry-level systems its always a struggle to get sufficient results. The operators golden hand is needed. Better controlled advanced dispensing systems should do the work, unluckily I
