Electronics Forum | Tue Jan 09 13:01:17 EST 2007 | stepheniii
Not unless it's a case of "the only difference is..." What I mean by that is more than once I've been told the only difference in a new rev is one component or one change. But the truth was that was the only reason for the change, and in fact there
Electronics Forum | Wed Jan 10 17:08:12 EST 2007 | mscalzo3
Brian, There are a couple of ideas that you can use for this. Slowing the ramp is the first one that comes to mind. I would try soaking at about 10 degrees "C" below the solidus of the alloy for about 45-60 seconds. Slowing the ramp to remove the
Electronics Forum | Fri Jan 19 07:54:56 EST 2007 | realchunks
I believe you are describing a pin in paste process. Not sure where a stencil is involved. Depending on you machine/pump, you can do damage to it by running paste thru it. Paste is a metal and will wear out internal parts. Also, most pastes used
Electronics Forum | Mon Jan 22 11:50:07 EST 2007 | BWET
Can anyone recommend a material which can be used an a bare board: 1. Dispensed via a syringe 2. Mimmic the electrical characteristics of a trace 3. Be processed such that they do not reflow with the solder interconnect 4. Be processed such that the
Electronics Forum | Wed Jan 31 17:57:07 EST 2007 | blnorman
We've had multiple issues with non-wetting components. You say only one part is not wetting? Profile won't be the culprit, if so you would have more part issues. We've used SnPb with lead-free parts for some time now, no issues. The issues we had
Electronics Forum | Fri Jan 26 16:47:35 EST 2007 | electronhose
IMHO I would avoid sprayed silicones like the plague. They can travel around your facility and cause solder wetting issues that you will never know the root cause for. Also found this e-drive article on using silicones around motors and relays. Loo
Electronics Forum | Wed Jan 31 17:01:34 EST 2007 | rw
I'm not that concerned about the solderability of the motor. Our customer is concerned about the outgassing of the conformal coat effecting the motor brushes. Silicone will break down into SiO2 and SiC will result from a spark between the brushes a
Electronics Forum | Mon Jan 29 09:50:37 EST 2007 | rgduval
I'm about to begin a job for a customer placing a couple of lead free BGA's/FPGA's on an assembly that doesn't need to be RoHS compatible. So...my question is...should I process this assembly with lead-free solder paste, to accomodate the lead-free
Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Wed Feb 07 07:45:50 EST 2007 | jax
Water soluble residues probably won't cause instant failures. The failures are most likely caused by excess paste being deposited on the center pad of the QFN. The excess solder keeps the part from sitting down in reflow and increases the possibility
