Electronics Forum | Wed Jan 22 09:59:28 EST 2003 | Juan C. Ruiz
I would like to know how to decide what to use: a batch oven or a conventional reflow oven to cure an underfill material that require 20 min@150 C. the size of the board is 50 X 100 mm. Cycle time previous to cure is 2 minutes. The lenght of the refl
Electronics Forum | Mon May 12 23:33:48 EDT 2003 | dehlers
I purchased three On-Site units a while back to feed two reflow ovens and one wave solder machine. The cost for the lot was approx. $160,000, and flow was approx. 7500 CFH. We were quit pleased wqith the performance and the operating cost. However
Electronics Forum | Wed Jan 22 19:37:48 EST 2003 | bradlanger
My company is getting into smt and am looking for advice on placement equipment. Our largest board is 7" x 13". The smallest parts are 0805, we only have soic so far and our volume is low to mid scale. Who makes a accurate, reliable, versitile, small
Electronics Forum | Wed Jan 22 19:41:03 EST 2003 | bradlanger
My company is getting into smt and I am looking for advice on placement equipment. Our largest board is 7" x 13". The smallest parts are 0805, we only have soic so far and our volume is low to mid scale. Who makes a accurate, reliable, versitile, sma
Electronics Forum | Thu Jan 23 08:54:12 EST 2003 | MA/NY DDave
Hi Woah you asked a complex question, and should soon be getting piles of assistance from many of the equipment mfgs sales guys that are on SMTnet. Poke around SMTnet would be one place I would start. Also look at some of the World Wide Auctions
Electronics Forum | Fri Jan 24 09:19:38 EST 2003 | bobbyv40
If your looking for a small footprint at lower cost a Zevetech 575 or Quad 4c should do a good job for you. If your boards get more complicated or you go down to fine pitch, 402's, BGA, you may need to look at a newer technology. We just went throug
Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto
Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it
Electronics Forum | Fri Jan 24 17:00:56 EST 2003 | razan3
RMA needs to be dry prior to the wave to work. If coverage is good and part orientation is good, then you should be okay. Pad size can be adding to the amount of material left as well. Granted it soldered before fine with .2 long leads, I would di
Electronics Forum | Fri Jan 31 14:06:09 EST 2003 | MA/NY DDave
Hi Wow, I can't imagine this set up. No wonder some of us were coming from opposing directions. My thoughts would be to buy another pot if needed and not go to N2. Do you have a site that we could look at the dynamics of this N2 air knife/ solder
Electronics Forum | Fri Jan 24 19:01:31 EST 2003 | MA/NY DDave
Hi It was a good answer that you should talk to a Metal Finisher specializing in Anodizing. They should be able to reduce your loss in base Aluminum. You are going to lose some Aluminum. Metals Handbooks has some articles on these processes. Try fi
