Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox
| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do
Electronics Forum | Thu May 20 10:09:16 EDT 1999 | Eric Maddy
| I am currently an employee of Cabeltron Systems in Ohio. Our manufacturing divisions have been outsourced to Celestica, strictly a business deal. No hard feelings there. Our building is located in Southern Ohio and will soon be vacant with 300 peop
Electronics Forum | Fri May 14 00:28:09 EDT 1999 | Mike D.
| I am seeing reflow around my signal pins after being subjected | to a profile of 204c for 1 minute and 225c for a min of 30 seconds. Signal pins are soldered into a copper plated alum. case with SB5 and then silver plated. The pins have a hot oil
Electronics Forum | Tue May 18 14:15:59 EDT 1999 | Scott McKee
| | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard micro-stencil, after
Electronics Forum | Wed May 12 10:38:51 EDT 1999 | Glenn Robertson
| We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | All other tips are also welcome. | | Thanks | Philip, My experience is primarily wi
Electronics Forum | Thu May 13 12:41:10 EDT 1999 | Eric
| | We are currently looking at purchasing some BGA rework equipment. Could someone give us the pro's and cons of IR heating (top/bottom)vs. hot air convection ? | | All other tips are also welcome. | | | | Thanks | | | Philip, | I have been doing
Electronics Forum | Mon May 10 12:15:46 EDT 1999 | Boca
We have been having an ongoing problems with radial electrolytic capacitors (thru hole)for some time. 1. When we wash them in our inline cleaners the sleeving shrinks up from the PCB leaving the 'can' exposed. Some designs have traces on the surf
Electronics Forum | Mon May 10 14:52:32 EDT 1999 | C.K.
| | | I left the company before this thing ever got resolved, so I don't know the answer, but here's what we did to get boards out the door. Baked them in a desicating oven. You know, the kind that pulls vacuum? It was a regular overnight process
Electronics Forum | Mon May 10 15:17:37 EDT 1999 | C.K.
| If I clean my assembly and find no visable contamination with the unaided eye, do I need to do cleanliness testing prior to conformal coating? | More than likely, you're okay if you can't see any contamination with the unaided eye. However, the
Electronics Forum | Wed May 05 23:26:29 EDT 1999 | Dean
| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what
